Difference between revisions of "IntlVac NanoQuest 1 IBE"

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== Standard Process Information ==
 
== Standard Process Information ==
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 +
- Etch rate of SiO2 deposited with QNF's CVD-01 at 500 V, 0 degree, 0 rotation is ~ 40 nm/min
 +
- Etch rate of SiO2 deposited with QNF's CVD-01 at 300 V, 0 degree, 0 rotation is ~ 15 nm/min
 +
 +
==== Process information from user community ====
  
 
  - Etch rate of Al deposited with QNF's PVD-06 at 400 V, 45 degree, 15 RPM rotation is ~ 60 nm/min
 
  - Etch rate of Al deposited with QNF's PVD-06 at 400 V, 45 degree, 15 RPM rotation is ~ 60 nm/min
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  - Etch rate of Pt deposited with QNF's PVD-02 at 500 V, 45 degree, 15 RPM rotation is ~ 20 nm/min
 
  - Etch rate of Pt deposited with QNF's PVD-02 at 500 V, 45 degree, 15 RPM rotation is ~ 20 nm/min
 
  - Etch rate of LiNbO3 at 500 V, 0 degree, 10 RPM rotation is ~ 40 nm/min
 
  - Etch rate of LiNbO3 at 500 V, 0 degree, 10 RPM rotation is ~ 40 nm/min
- Etch rate of SiO2 deposited with QNF's CVD-01 at 500 V, 0 degree, 0 rotation is ~ 40 nm/min
 
- Etch rate of SiO2 deposited with QNF's CVD-01 at 300 V, 0 degree, 0 rotation is ~ 15 nm/min
 
  
 
===== SOPs & Troubleshooting =====
 
===== SOPs & Troubleshooting =====

Revision as of 08:37, 3 October 2024


IntlVac Nanoquest 1
[[]]
Tool Name IntlVac IBE
Instrument Type Etch
Staff Manager Sam Azadi
Lab Location Bay 2
Tool Manufacturer IntlVac
Tool Model Nanoquest 1
NEMO Designation DE-01
Lab Phone 215-898-9748
SOP Link SOP

Description

Nanoquest 1 is an ion miller connected to Ar gas and capable of etch small mm-scale samples up to full 4" wafers. The tool is equipped with a secondary ion mass spectroscopy (SIMS) unit and is capable of etch with manual endpoint detection. The stage has a tilt motor that allows for etch angles between 0 (directly facing the beam) and 90 degrees (parallel to the beam).

The tool in QNF is connected to Ar gas and can etch samples up to 4" wafer. Available beam voltages are: 300 V, 400 V, 450 V, and 500 V

Applications
  • Ion milling


Resources

manual loading/unloading operation video

Standard Process Information

- Etch rate of SiO2 deposited with QNF's CVD-01 at 500 V, 0 degree, 0 rotation is ~ 40 nm/min
- Etch rate of SiO2 deposited with QNF's CVD-01 at 300 V, 0 degree, 0 rotation is ~ 15 nm/min 

Process information from user community

- Etch rate of Al deposited with QNF's PVD-06 at 400 V, 45 degree, 15 RPM rotation is ~ 60 nm/min
- Etch rate of Al deposited with QNF's PVD-06 at 500 V, 45 degree, 15 RPM rotation is ~ 100 nm/min
- Etch rate of AlScN deposited with QNF's PVD-06 at 500 V, 45 degree, 15 RPM rotation is ~ 43 nm/min
- Etch rate of Pt deposited with QNF's PVD-02 at 500 V, 45 degree, 15 RPM rotation is ~ 20 nm/min
- Etch rate of LiNbO3 at 500 V, 0 degree, 10 RPM rotation is ~ 40 nm/min
SOPs & Troubleshooting