Difference between revisions of "SUSS MicroTec AS8 AltaSpray"

**SUSS MicroTec AS8 AltaSpray**
Tool Name	SUSS MicroTec AS8 AltaSpray
Instrument Type	Lithography
Staff Manager	David Jones
Lab Location	Bay 2
Tool Manufacturer	SUSS MicroTec
Tool Model	AS8 AltaSpray
NEMO Designation	{{{NEMO_Designation}}}
Lab Phone	XXXXX
SOP Link	SOP

Revision as of 13:30, 22 September 2023

Description

SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm.

Applications

Automated resist spray coater for high topographies

Resources

Process characterization and tool data

Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater

SOPs & Troubleshooting

QNF SOP
[https://upenn.box.com/s/gn8plnqgwwdn948zo0pywwnm0i1s93y4 AS8 Spray Coater Reboot Procedure

@@ Line 31: / Line 31: @@
 ===== SOPs & Troubleshooting =====
 * [https://www.seas.upenn.edu/~nanosop/SprayCoater_SOP.htm QNF SOP]
+* [https://upenn.box.com/s/gn8plnqgwwdn948zo0pywwnm0i1s93y4 AS8 Spray Coater Reboot Procedure