Difference between revisions of "CEE 200X Spinner"
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(update tool owner, update to NEMO) |
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Line 7: | Line 7: | ||
| imagecaption = | | imagecaption = | ||
| Instrument_Type = Lithography | | Instrument_Type = Lithography | ||
− | | Staff_Manager = | + | | Staff_Manager = [[Ana Cohen | Ana Cohen]] |
| Lab_Location = Soft Lithography | | Lab_Location = Soft Lithography | ||
| Tool_Manufacturer = CEE | | Tool_Manufacturer = CEE | ||
| Tool_Model = 200X | | Tool_Model = 200X | ||
− | | | + | | NEMO_Designation = SPN-07 |
| Lab_Phone = 3-9639 | | Lab_Phone = 3-9639 | ||
| SOP Link = [https://repository.upenn.edu/scn_sop/10/ SOP] | | SOP Link = [https://repository.upenn.edu/scn_sop/10/ SOP] |
Revision as of 13:15, 3 January 2024
Tool Name | Spinner - SU8/PDMS |
---|---|
Instrument Type | Lithography |
Staff Manager | Ana Cohen |
Lab Location | Soft Lithography |
Tool Manufacturer | CEE |
Tool Model | 200X |
NEMO Designation | SPN-07 |
Lab Phone | 3-9639 |
SOP Link | SOP |
Description
Spinner for coating substrates with thicker resists as well as PDMS. Control of ramp rate and speed. Includes wafer centering step.