Difference between revisions of "Denton Explorer14 Magnetron Sputterer"
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! Tool Name !! Tool ID !! Tool Group | ! Tool Name !! Tool ID !! Tool Group | ||
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| − | | EVG 510 Wafer Bonder || BE-01 || Backend | + | | EVG 510 Wafer Bonder || BE-01 || Backend |
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Revision as of 15:42, 5 May 2022
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| Tool Name | Denton Explorer14 Magnetron Sputterer |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 2 |
| Tool Manufacturer | Denton |
| Tool Model | Explorer14 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs.
The tool is an open load system in sputter-down configuration with one dedicated DC gun and two guns that can use either a DC or RF power supply. Codeposition from two DC sources or one DC and one RF source is possible. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.
Maximum DC Power is 600 W.
Maximum RF Power is 200 W.
Deposition Sources
- ITO
- Cr
- Ti
- Ni
- Cu
- Al
- SiO2
- Ge
- Pt
- Au
- Ag
- Pd
- Si
- Al2O3
- Mo
- Various others - please contact staff
Deposition Power
| Tool Name | Tool ID | Tool Group |
|---|---|---|
| EVG 510 Wafer Bonder | BE-01 | Backend |