Difference between revisions of "SUSS MicroTec AS8 AltaSpray"
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== Resources == | == Resources == | ||
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| + | ===== Process characterization and tool data ===== | ||
| + | * [https://repository.upenn.edu/scn_tooldata/46/ Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater] | ||
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===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://www.seas.upenn.edu/~nanosop/SprayCoater_SOP.htm QNF SOP] | * [https://www.seas.upenn.edu/~nanosop/SprayCoater_SOP.htm QNF SOP] | ||
Revision as of 10:33, 28 November 2022
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| Tool Name | SUSS MicroTec AS8 AltaSpray |
|---|---|
| Instrument Type | Lithography |
| Staff Manager | David Jones |
| Lab Location | Bay 2 |
| Tool Manufacturer | SUSS MicroTec |
| Tool Model | AS8 AltaSpray |
| NEMO Designation | {{{NEMO_Designation}}} |
| Nearest Phone | XXXXX |
| SOP Link | SOP |
Description
SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm.
Applications
- Automated resist spray coater for high topographies
Resources
Process characterization and tool data