Difference between revisions of "ADT 7100 Dicing Saw"

From Quattrone Nanofabrication Facility
Jump to navigation Jump to search
(Created page with "Category:Back End {{EquipmentInfo | name = ADT 7100 Dicing Saw | Tool_Name = ADT 7100 Dicing Saw | image = 300px | imagecaption = | Instrument_Type...")
 
Line 12: Line 12:
 
| Tool_Model = 7100
 
| Tool_Model = 7100
 
| Iris_Designation = BE-04
 
| Iris_Designation = BE-04
| Lab_Phone = XXXXX
+
| Lab_Phone = none
 
| SOP Link = [https://repository.upenn.edu/scn_sop/17/ SOP]
 
| SOP Link = [https://repository.upenn.edu/scn_sop/17/ SOP]
 
}}
 
}}
Line 29: Line 29:
 
===== SOPs & Troubleshooting =====
 
===== SOPs & Troubleshooting =====
 
* [https://repository.upenn.edu/scn_sop/17/ QNF SOP]
 
* [https://repository.upenn.edu/scn_sop/17/ QNF SOP]
 +
* [https://alliance.seas.upenn.edu/~qnf/wiki/index.php?title=File:DicingSelection.png | Dicing Blade Selection]

Revision as of 20:07, 6 April 2022


ADT 7100 Dicing Saw
BE-04.jpeg
Tool Name ADT 7100 Dicing Saw
Instrument Type Back End
Staff Manager Dave Jones
Lab Location Bay 2
Tool Manufacturer Advanced Dicing Technologies (ADT)
Tool Model 7100
NEMO Designation {{{NEMO_Designation}}}
Lab Phone none
SOP Link SOP

Description

Workhorse dicing saw with precision dicing and alignment system. This is an automated tool with a 2″, DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.), with closed-loop turntable, and is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.

Applications
  • Dicing of Si wafers
  • Dicing of glass wafers
  • Dicing of sapphire wafers


Resources

SOPs & Troubleshooting