Difference between revisions of "Intlvac E-beam Evaporator"
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| name = Intlvac E-Beam Evaporator | | name = Intlvac E-Beam Evaporator | ||
| Tool_Name = Intlvac E-Beam Evaporator | | Tool_Name = Intlvac E-Beam Evaporator | ||
| − | | image = [[Image:PVD- | + | | image = [[Image:PVD-09.jpeg|300px]] |
| imagecaption = | | imagecaption = | ||
| Instrument_Type = Physical vapor deposition | | Instrument_Type = Physical vapor deposition | ||
Revision as of 14:43, 30 August 2024
| 300px | |
| Tool Name | Intlvac E-Beam Evaporator |
|---|---|
| Instrument Type | Physical vapor deposition |
| Staff Manager | David Barth |
| Lab Location | Bay 2 |
| Tool Manufacturer | Intlvac |
| Tool Model | |
| NEMO Designation | PVD-09 |
| Lab Phone | 215-898-9748 |
| SOP Link | SOP |
Description
The tool
The IntlVac Electron Beam Evaporator has a base process chamber pressure in the e-8 Torr range with substrate heating and ozone purging capabilities. Deposition rates are monitored by an automated magazine of 6MHz crystals. The tool can be used to process a single 4 inch wafer at a time or a selection of small chips/pieces.
Available materials
The tool contains the following materials:
- Al - Aluminum
- Ti - Titanium
Resources
SOPs & Troubleshooting
Link: