Difference between revisions of "Oxford PlasmaLab 100 PECVD"
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| imagecaption = | | imagecaption = | ||
| Instrument_Type = Deposition | | Instrument_Type = Deposition | ||
| − | | Staff_Manager = Sam Azadi | + | | Staff_Manager = [[Sam Azadi | Sam Azadi]] |
| Lab_Location = Bay 1 | | Lab_Location = Bay 1 | ||
| Tool_Manufacturer = Oxford | | Tool_Manufacturer = Oxford | ||
| Tool_Model = PlasmaLab 100 | | Tool_Model = PlasmaLab 100 | ||
| − | | | + | | NEMO_Designation = CVD-01 |
| Lab_Phone = 215-898-9736 | | Lab_Phone = 215-898-9736 | ||
| SOP Link = [https://repository.upenn.edu/scn_sop/5/ QNF SOP] | | SOP Link = [https://repository.upenn.edu/scn_sop/5/ QNF SOP] | ||
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* Silicon dioxide deposition | * Silicon dioxide deposition | ||
* Silicon nitride deposition | * Silicon nitride deposition | ||
| − | * Amorphous silicon deposition | + | * [[Amorphous silicon deposition | Amorphous silicon deposition]] |
===== Allowed material in PECVD System ===== | ===== Allowed material in PECVD System ===== | ||
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=== Standard process data - Table temperature fixed at 350 C === | === Standard process data - Table temperature fixed at 350 C === | ||
| − | * SiO2 | + | * SiO2 on 01/09/2024 |
Recipe parameters: optimized process parameters are in the report under "Protocols and Reports" section | Recipe parameters: optimized process parameters are in the report under "Protocols and Reports" section | ||
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Recipe name on the tool: Test-SiO2 | Recipe name on the tool: Test-SiO2 | ||
| − | Deposition rate: ~ | + | Deposition rate: ~ 291 nm/min ± 5 nm/min |
| − | * SiNx | + | * SiNx on 07/29/2024 |
Recipe parameters: optimized process parameters are in the report under "Protocols and Reports" section | Recipe parameters: optimized process parameters are in the report under "Protocols and Reports" section | ||
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Recipe name on the tool: Test-SiNx deposition | Recipe name on the tool: Test-SiNx deposition | ||
| − | Deposition rate: ~ | + | Deposition rate: ~ 46 nm/min ± 2 nm/min |
| − | * a-Si | + | * a-Si on 01/09/2024 |
Recipe parameters: optimized process parameters are in the report under "Protocols and Reports" section | Recipe parameters: optimized process parameters are in the report under "Protocols and Reports" section | ||
| Line 94: | Line 94: | ||
Recipe name on the tool: a-Si | Recipe name on the tool: a-Si | ||
| − | Deposition rate: ~ | + | Deposition rate: ~ 60 nm/min ± 5 nm/min |
| + | |||
| + | |||
| + | ==== Deposition Rate Monitoring ==== | ||
| + | [[Image:Sio2 dep on cvd-01.jpg|left|500px]] [[Image:Sinx dep rate on cvd-01.jpg|center|500px]] | ||
| + | |||
=== Special process data - adjustable table temperature === | === Special process data - adjustable table temperature === | ||
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Deposition rate: ~ 230 nm/min ± 2 nm/min | Deposition rate: ~ 230 nm/min ± 2 nm/min | ||
| − | |||
| − | |||
== Resources == | == Resources == | ||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
| − | * [https://repository.upenn.edu/scn_sop/ | + | * [https://repository.upenn.edu/scn_sop/5/ QNF SOP] |
| + | * [https://upenn.box.com/s/sglgbidfjpw36f6v50rzgcpll5yliloc/ PECVD Table Temp Tuning Procedure] | ||
===== Protocols and Reports ===== | ===== Protocols and Reports ===== | ||
Latest revision as of 13:41, 14 October 2024
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| Tool Name | Oxford PlasmaLab 100 PECVD |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 1 |
| Tool Manufacturer | Oxford |
| Tool Model | PlasmaLab 100 |
| NEMO Designation | CVD-01 |
| Lab Phone | 215-898-9736 |
| SOP Link | QNF SOP |
Description
The QNF Oxford Instruments PlasmaLab System 100 Plasma Enhanced Chemical Vapor Deposition (PECVD) tool is used to deposit a variety of thin-film materials at relatively modest temperatures on a variety of substrate materials. The tool utilizes an RF generator to deposit thin films at temperatures lower than traditional chemical vapor deposition systems. The tool operates between 150 and 350 C.
Applications
- Silicon dioxide deposition
- Silicon nitride deposition
- Amorphous silicon deposition
Allowed material in PECVD System
- Si, SixNy, SiO2, SOI, SiC, GaN
- Al, Pt, Cr, W, Mo, Ti
- Hard masks compatible with process temperature
List of materials NOT allowed in the chamber
| Name | symbol | Melting Point [C] |
|---|---|---|
| Bismuth | Bi | 271 |
| Cadmium | Cd | 321 |
| Carbon | C | Subl. |
| Gallium | Ga | 30 |
| Gold | Au | 1062 |
| Indium | In | 157 |
| Lead | Pb | 328 |
| Lithium | Li | 179 |
| Selenium | Se | 217 |
| Sulfur | S | 115 |
| Tellurium | Te | 452 |
| Thallium | Tl | 302 |
| Tin | Sn | 232 |
| Zinc | Zn | 419 |
Process information
Standard process data - Table temperature fixed at 350 C
- SiO2 on 01/09/2024
Recipe parameters: optimized process parameters are in the report under "Protocols and Reports" section
Recipe name on the tool: Test-SiO2
Deposition rate: ~ 291 nm/min ± 5 nm/min
- SiNx on 07/29/2024
Recipe parameters: optimized process parameters are in the report under "Protocols and Reports" section
Recipe name on the tool: Test-SiNx deposition
Deposition rate: ~ 46 nm/min ± 2 nm/min
- a-Si on 01/09/2024
Recipe parameters: optimized process parameters are in the report under "Protocols and Reports" section
Recipe name on the tool: a-Si
Deposition rate: ~ 60 nm/min ± 5 nm/min
Deposition Rate Monitoring
Special process data - adjustable table temperature
- SiO2
Recipe parameters: optimized process parameters are in the report under "Protocols and Reports" section - table temperature at 200 C
Recipe name on the tool: Test-SiO2
Deposition rate: ~ 230 nm/min ± 2 nm/min