Difference between revisions of "SUSS MicroTec AS8 AltaSpray"
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| − | [[Category:Lithography]] | + | [[Category:Lithography]][[Category:Photolithography]][[Category:Resist Coating]][[Category:Equipment]] |
{{EquipmentInfo | {{EquipmentInfo | ||
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== Resources == | == Resources == | ||
| + | |||
| + | ===== SOPs & Troubleshooting ===== | ||
| + | * [https://nemo.nano.upenn.edu/media/tool_documents/rc-01-suss-spray-coater/RC-01_SOP_v01.pdf QNF SOP] | ||
| + | * [https://upenn.box.com/s/gn8plnqgwwdn948zo0pywwnm0i1s93y4 AS8 Spray Coater Reboot Procedure] | ||
===== Process characterization and tool data ===== | ===== Process characterization and tool data ===== | ||
* [https://repository.upenn.edu/scn_tooldata/46/ Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater] | * [https://repository.upenn.edu/scn_tooldata/46/ Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater] | ||
| − | + | ===== About spray-coating ===== | |
| − | ===== | + | * [https://www.microchemicals.com/dokumente/application_notes/spray_coating_photoresist.pdf Basics - MicroChemicals] |
| − | * [https:// | ||
| − | |||
Latest revision as of 12:32, 28 July 2025
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| Tool Name | SUSS MicroTec AS8 AltaSpray |
|---|---|
| Instrument Type | Lithography |
| Staff Manager | Ana Cohen |
| Lab Location | Bay 5 |
| Tool Manufacturer | SUSS MicroTec |
| Tool Model | AS8 AltaSpray |
| NEMO Designation | RC-01 |
| Nearest Phone | XXXXX |
| SOP Link | SOP |
Description
SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm.
Applications
- Automated resist spray coater for high topographies