Difference between revisions of "RTA-01"
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| image = [[Image:RTA01.jpg|300px]] | | image = [[Image:RTA01.jpg|300px]] | ||
| imagecaption = | | imagecaption = | ||
− | | Instrument_Type = | + | | Instrument_Type = Thermal Processing |
| Staff_Manager = [[Lucas Barreto | Lucas Barreto]] | | Staff_Manager = [[Lucas Barreto | Lucas Barreto]] | ||
− | | Lab_Location = Bay | + | | Lab_Location = Bay 1 |
| Tool_Manufacturer = AET | | Tool_Manufacturer = AET | ||
| Tool_Model = Thermal RX | | Tool_Model = Thermal RX | ||
| NEMO_Designation = RTA-01 | | NEMO_Designation = RTA-01 | ||
| Lab_Phone = 215-898-9736 | | Lab_Phone = 215-898-9736 | ||
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}} | }} | ||
== Description == | == Description == | ||
− | The Rapid Thermal Annealer-01 anneals the sample up to 1200° C. The processes can be run under atmospheric pressure in Oxygen, Nitrogen, Forming Gas, and Argon environments. The tool can hold 4’’ wafers or smaller chips. Only MOS-compatible materials are allowed. Compound semiconductors and metals are not allowed. | + | The Rapid Thermal Annealer-01 anneals the sample up to 1200° C. The processes can be run under atmospheric pressure in Oxygen, Nitrogen, Forming Gas, and Argon environments. The tool can hold 4’’ wafers or smaller chips. Only MOS-compatible materials are allowed. Compound semiconductors and metals are not allowed. |
− | |||
− | |||
== Resources == | == Resources == | ||
+ | ===== SOP ===== | ||
+ | <pdf height="800"> File:RTA01_SOP_20240909.pdf</pdf> |
Latest revision as of 13:44, 9 September 2024
Tool Name | Rapid Thermal Annealer - 01 |
---|---|
Instrument Type | Thermal Processing |
Staff Manager | Lucas Barreto |
Lab Location | Bay 1 |
Tool Manufacturer | AET |
Tool Model | Thermal RX |
NEMO Designation | RTA-01 |
Lab Phone | 215-898-9736 |
SOP Link | {{{SOP Link}}} |
Description
The Rapid Thermal Annealer-01 anneals the sample up to 1200° C. The processes can be run under atmospheric pressure in Oxygen, Nitrogen, Forming Gas, and Argon environments. The tool can hold 4’’ wafers or smaller chips. Only MOS-compatible materials are allowed. Compound semiconductors and metals are not allowed.
Resources
SOP