Difference between revisions of "Heidelberg DWL 66+ Laser Writer"

**Heidelberg DWL 66+ Laser Writer**
Tool Name	Heidelberg DWL 66+ Laser Writer
Instrument Type	Lithography
Staff Manager	Ana Cohen
Lab Location	Bay 4
Tool Manufacturer	Heidelberg
Tool Model	DWL 66+
NEMO Designation	LW-01
Lab Phone	8-9799
SOP Link	SOP

Latest revision as of 18:41, 28 October 2024

Description

The fully automated DWL 66+ laser writing system is located inside an environment chamber for stable environment of the system with controlled laminar airflow and temperature stability. The chamber is situated on a granite base with air cushions for vibration isolation. The optical system includes highly reflective mirrors and acousto-optic modulators for real-time beam correction. The laser is 405nm wavelength (h-line).

Lens & Resolution

2 mm lens (optical autofocus): 600 nm
10 mm lens (pneumatic autofocus): 2 µm
40 mm lens (pneumatic autofocus): 10 µm

Applications

Patterning of photomasks
Direct laser writing on substrates, from 6" wafers down to 10mm x 10mm pieces

Allowed Materials

Mask Plates -- available in the QNF Stockroom pre-coated with AZ1500 and IP3500
Resists -- must be compatible with h-line exposure

Processes

The following exposure parameters may be used to expose photomasks.

Resist	Write Head	Filter(s)	Laser Power (mW)	Intensity	Focus	# of passes	Focus mode
AZ1500	10mm	25%	70	50%	-30	1	Pneumatic
IP3500	10mm	NONE	70	50%	-30	1	Pneumatic
AZ1500	2mm	12.5%+25%+50%	60	50%	-15	1	Pneumatic
IP3500	2mm	12.5%+25%	60	50%	-15	1	Pneumatic

The following exposure parameters may be used to direct write into S18xx resist on silicon (soft baked at 115C for 60s, development in TMAH 0.26N for 60s). For the optimum focus, please refer to the "AZ1500.txt" or "IP3500.txt" files for the optimum value to use. [May not be up-to-date. It is always a good idea to check your resist thickness and run a dose test to confirm optimal parameters.]

Resist	Spin Speed (RPM)	Write Head	Filter(s)	Laser Power (mW)	Intensity	# passes	Focus mode
S1805	3000	10mm	12.5%	105	60%	1	pneumatic
S1805	3000	2mm	1% & 50%	TBD	TBD	1	pneumatic
KL5315	5000	10mm	50%	TBD	TBD	1	pneumatic
KL5315	5000	2mm	1%	TBD	TBD	1	pneumatic
S1818	3000	10mm	NONE	65	60%	1	pneumatic
S1818	3000	2mm	12.5% & 25%	TBD	TBD	1	pneumatic

  
 S1818 at 3000rpm (2.2um thickness) with 10mm writehead [Feb 2024]
 65mW, NO Filter, 70% intensity, + 20 focus
 5um, 10um, 25um, and 50um line widths after 60s TMAH 0.26N development

Resources

SOPs & Troubleshooting

@@ Line 7: / Line 7: @@
 | imagecaption =
 | Instrument_Type = Lithography
-| Staff_Manager = David Jones
+| Staff_Manager = [[Ana Cohen | Ana Cohen]]
-| Lab_Location = Bay 2
+| Lab_Location = Bay 4
 | Tool_Manufacturer = Heidelberg
 | Tool_Model = DWL 66+
-| Iris_Designation = LW-01
+| NEMO_Designation = LW-01
 | Lab_Phone = 8-9799
-| SOP Link = [https://repository.upenn.edu/scn_protocols/76/ SOP]
+| SOP Link = [https://nemo.nano.upenn.edu/media/tool_documents/lw-01-heidelberg-dwl66/LW-01_SOP_v02.pdf SOP]
 }}
 == Description ==
-The fully automated DWL 66+ laser writing system is located inside an environment chamber for stable environment of the system with controlled laminar airflow and temperature stability. The chamber is situated on a granite base with air cushions for vibration isolation. The optical system includes highly reflective mirrors and acousto-optic modulators for real-time beam correction.
+The fully automated DWL 66+ laser writing system is located inside an environment chamber for stable environment of the system with controlled laminar airflow and temperature stability. The chamber is situated on a granite base with air cushions for vibration isolation. The optical system includes highly reflective mirrors and acousto-optic modulators for real-time beam correction. The laser is 405nm wavelength (h-line).
 '''Lens & Resolution'''
@@ Line 24: / Line 24: @@
 * 40 mm lens (pneumatic autofocus): 10 µm
+===== Applications =====
+* [https://nemo.nano.upenn.edu/media/tool_documents/lw-01-heidelberg-dwl66/How_to_Make_a_Mask_At_QNF_v05.pdf Patterning of photomasks]
+* Direct laser writing on substrates, from 6" wafers down to 10mm x 10mm pieces
-===== Applications =====
+===== Allowed Materials =====
-* Patterning of photomasks
+* Mask Plates -- available in the [https://nemo.nano.upenn.edu/stockroom/ QNF Stockroom] pre-coated with AZ1500 and IP3500
-* Direct laser writing of patterns
+* Resists -- must be compatible with h-line exposure
+** [[Resists_at_QNF#QNF_Supplied_Standard_Photoresists | S1800 series]]
+** [[Resists_at_QNF#Miscellaneous | KL5300 series]]
+** [[Resists_at_QNF#Other_Resists | LOR]]
 == Processes ==
-The following exposure parameters may be used to expose photomasks.
+The following exposure parameters may be used to expose photomasks. <em>  </em>
 {| class="wikitable" style="vertical-align:bottom;"
 |-
@@ Line 45: / Line 51: @@
 | 10mm
 | 25%
-| 60
+| 70
-| 60%
+| 50%
-| -20
+| -30
 | 1
 | Pneumatic
@@ Line 53: / Line 59: @@
 | IP3500
 | 10mm
+| NONE
+| 70
 | 50%
+| -30
+| 1
+| Pneumatic
+|-
+| AZ1500
+| 2mm
+| 12.5%+25%+50%
 | 60
 | 50%
-| -20
+| -15
 | 1
 | Pneumatic
@@ Line 62: / Line 77: @@
 | IP3500
 | 2mm
-| 25% & 12.5%
+| 12.5%+25%
 | 60
 | 50%
-| 0
+| -15
 | 1
 | Pneumatic
@@ Line 71: / Line 86: @@
-The following exposure parameters may be used to direct write into S1800 resist (soft baked at 115C for 1 minute) on silicon.  For the optimum focus, please refer to the "AZ1500.txt" or "IP3500.txt" files for the optimum value to use.
+The following exposure parameters may be used to direct write into S18xx resist on silicon (soft baked at 115C for 60s, development in TMAH 0.26N for 60s).  For the optimum focus, please refer to the "AZ1500.txt" or "IP3500.txt" files for the optimum value to use. [May not be up-to-date. It is always a good idea to check your resist thickness and run a dose test to confirm optimal parameters.]
 {| class="wikitable"
@@ Line 87: / Line 102: @@
 | 3000
 | 10mm
-| 25%
+| 12.5%
-| 35
+| 105
 | 60%
 | 1
@@ Line 97: / Line 112: @@
 | 2mm
 | 1% & 50%
-| 105
+| TBD
-| 100%
+| TBD
 | 1
 | pneumatic
@@ Line 106: / Line 121: @@
 | 10mm
 | 50%
-| 35
+| TBD
-| 70%
+| TBD
 | 1
 | pneumatic
@@ Line 115: / Line 130: @@
 | 2mm
 | 1%
-| 75
+| TBD
-| 100%
+| TBD
 | 1
 | pneumatic
@@ Line 123: / Line 138: @@
 | 3000
 | 10mm
-| 50%
+| NONE
 | 65
-| 80%
+| 60%
 | 1
 | pneumatic
@@ Line 133: / Line 148: @@
 | 2mm
 | 12.5% & 25%
-| 60
+| TBD
-| 60%
+| TBD
 | 1
 | pneumatic
 |}
+  [[File:LW-01 S1818Lines 25um Feb2024.png|400px|]] [[File:LW-01 S1818Lines 5um Feb2024.png|400px|]]
+  S1818 at 3000rpm (2.2um thickness) with 10mm writehead [Feb 2024]
+mW, NO Filter, 70% intensity, + 20 focus
+um, 10um, 25um, and 50um line widths after 60s TMAH 0.26N development
 == Resources ==
+* [https://nemo.nano.upenn.edu/media/tool_documents/lw-01-heidelberg-dwl66/How_to_Make_a_Mask_At_QNF_v05.pdf How to Make a Mask at QNF]
+* [https://www.youtube.com/playlist?list=PLiihbHV9HgpWZikttBFUh2O8EGUsRu348 Videos - BEAMER Training for LW-01]
 ===== SOPs & Troubleshooting =====
-* [https://repository.upenn.edu/scn_protocols/76/ QNF SOP]
+* [https://nemo.nano.upenn.edu/media/tool_documents/lw-01-heidelberg-dwl66/LW-01_SOP_v02.pdf SOP]
+* [https://www.youtube.com/watch?v=q_mvEGSCEGI&list=PLiihbHV9HgpWAcmgdpMGBkejcBhEzoKJO Videos - LW-01 Tool Training]
+* [https://drive.google.com/file/d/1MUMPdLl4GfXtmg3gJjdiPKbdiyCq-elM/view?usp=drive_link Video - Chuck Installation/Removal]