Difference between revisions of "SUSS MicroTec AS8 AltaSpray"
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| Line 7: | Line 7: | ||
| imagecaption = | | imagecaption = | ||
| Instrument_Type = Lithography | | Instrument_Type = Lithography | ||
| − | | Staff_Manager = | + | | Staff_Manager = [[Ana Cohen | Ana Cohen]] |
| − | | Lab_Location = Bay | + | | Lab_Location = Bay 5 |
| Tool_Manufacturer = SUSS MicroTec | | Tool_Manufacturer = SUSS MicroTec | ||
| Tool_Model = AS8 AltaSpray | | Tool_Model = AS8 AltaSpray | ||
| − | | | + | | NEMO_Designation = RC-01 |
| Lab_Phone = XXXXX | | Lab_Phone = XXXXX | ||
| SOP Link = [https://www.seas.upenn.edu/~nanosop/SprayCoater_SOP.htm SOP] | | SOP Link = [https://www.seas.upenn.edu/~nanosop/SprayCoater_SOP.htm SOP] | ||
Latest revision as of 10:43, 28 June 2024
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| Tool Name | SUSS MicroTec AS8 AltaSpray |
|---|---|
| Instrument Type | Lithography |
| Staff Manager | Ana Cohen |
| Lab Location | Bay 5 |
| Tool Manufacturer | SUSS MicroTec |
| Tool Model | AS8 AltaSpray |
| NEMO Designation | RC-01 |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm.
Applications
- Automated resist spray coater for high topographies
Resources
Process characterization and tool data