Difference between revisions of "Denton Explorer14 Magnetron Sputterer"
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===== Tool overview ===== | ===== Tool overview ===== | ||
| − | The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. The tool is an open load system in sputter-down configuration with one dedicated DC | + | The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films (such as oxides). Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. The tool is an open load system in sputter-down configuration with one dedicated DC source and two sources that can use either a DC or RF power supply. Co-deposition from two DC sources or one DC and one RF source is possible, but it is recommended to run co-deposition on PVD-03 as the sources in this tool are not in confocal mode per default. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling. |
===== Maximum power ===== | ===== Maximum power ===== | ||
Revision as of 16:41, 23 January 2023
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| Tool Name | Denton Explorer14 Magnetron Sputterer |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | Jason (jarohr@seas.upenn.edu) |
| Lab Location | Bay 2 |
| Tool Manufacturer | Denton |
| Tool Model | Explorer14 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | 215-898-9748 |
| SOP Link | SOP |
Description
Tool overview
The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films (such as oxides). Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs. The tool is an open load system in sputter-down configuration with one dedicated DC source and two sources that can use either a DC or RF power supply. Co-deposition from two DC sources or one DC and one RF source is possible, but it is recommended to run co-deposition on PVD-03 as the sources in this tool are not in confocal mode per default. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.
Maximum power
- Maximum DC Power: 600 W.
- Maximum RF Power: 200 W.
You can inflict serious damage to the power supplies if these values are exceeded.
Available materials & process data
All process data were recorded at a base pressure lower than 5 x 10-6 Torr; you can never exceed 200 W on RF and 600 W on DC.
| Material Name | Max power | Process data | Recorded | ||
|---|---|---|---|---|---|
| Pressure | Power | Rate | |||
| Ag (silver) | 450 W | 3 mTorr | 140 W | 7.3 Å s-1 | |
| Al (aluminum) | 450 W | 3 mTorr | 200 W | 3.0 Å s-1 | |
| Au (gold) | 140 W | 3 mTorr | 140 W | 4.6 Å s-1 | |
| Cr (chromium) | 450 W | - | - | - | |
| Cu (copper) | 450 W | 3 mTorr | 400 W | 3.4 Å s-1 | |
| Fe (iron) | 350 W | - | - | - | |
| Ge (germanium) | 140 W | - | - | - | |
| ITO (Indium tin oxide) | 140 W | - | - | - | |
| Mn (manganese) | 140 W | - | - | - | |
| Mo (molybdenum) | 450 W | 3 mTorr | 140 | 1.9 Å s-1 | |
| Ni (nickel) | 350 W | - | - | - | |
| Pd (palladium) | 140 W | - | - | - | |
| Pt (platinum) | 140 W | 3 mTorr | 140 W | 2.6 Å s-1 | |
| i-Si (intrinsic silicon) | 140 W | - | - | - | |
| n-Si (n-type silicon) | 280 W | - | - | - | |
| p-Si (p-type silicon) | 280 W | - | - | - | |
| Ti (titanium) | 350 W | 3 mTorr | 350 W | 2.0 Å s-1 | |
| TiO2 (titanium dioxide) | 140 W | - | - | - | |
| W (tungsten) | 450 W | - | - | - | |
| YSZ (yttria-stabilized zirconia) | 140 W | - | - | - | |
Resources
SOPs & Troubleshooting
Master recipes
Coming soon
| Step Number | T000 | T001 | T002 | T003 | T004 | T005 | T006 |
|---|---|---|---|---|---|---|---|
| Step Time (sec) | - | - | - | - | - | - | - |
| Min Vacuum Setpoint (Torr) | - | - | - | - | - | - | - |
| Gas - (PID or Fixed) | - | - | - | - | - | - | - |
| Gas - PID Master Gas Select | - | - | - | - | - | - | - |
| Gas1 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas2 - Setpoint (sccm) | - | - | - | - | - | - | - |
| Gas PID Pressure (mTorr) | - | - | - | - | - | - | - |
| RF Source - Sputter (Watts) | - | - | - | - | - | - | - |
| RF Source - Cathode Select | - | - | - | - | - | - | - |
| RF Source - Shutter | - | - | - | - | - | - | - |
| DC 1 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 1 Source - Cathode Select | - | - | - | - | - | - | - |
| DC 1 Source - Shutter | - | - | - | - | - | - | - |
| DC 2 Source - Sputter (Watts) | - | - | - | - | - | - | - |
| DC 2 Source - Shutter | - | - | - | - | - | - | - |
| Pressure Control (Throttle) | - | - | - | - | - | - | - |
| Ignition Pressure (mTorr) | - | - | - | - | - | - | - |
| Rotation Speed (0-100%) | - | - | - | - | - | - | - |
| End Process (Yes) | - | - | - | - | - | - | - |