Difference between revisions of "Lesker PVD75 DC/RF Sputterer"

**Lesker PVD75 DC/RF Sputterer**
Tool Name	Lesker PVD75 DC/RF Sputterer
Instrument Type	Deposition
Staff Manager	David Barth
Lab Location	Bay 2
Tool Manufacturer	Kurt J. Lesker
Tool Model	PVD75
NEMO Designation	{{{NEMO_Designation}}}
Lab Phone	XXXXX
SOP Link	SOP

Revision as of 10:40, 8 July 2022

Tool description

The Kurt J. Lesker PVD75 Sputter system is configured with 4 sputter guns in the following configuration:

Target 1: RF power, insulating/conductive target
Target 2: DC power, magnetic/non-magnetic conductive target
Target 3: DC power, non-magnetic conductive target
Target 4: DC power, magnetic/non-magnetic conductive target

The system is cryo-pumped process chamber with an automated interface, wafer platen rotation and heating up to 550°C, accepting sample sized from pieces to 150 mm diameter wafers.

When choosing between PVD-03 and PVD-05, consider the following:

PVD-03 is a load-locked system so base pressure will be better (~5e-8 torr vs. ~5e-6 torr) and pumpdown times will be much faster compared with PVD-05, which is an open load system.
PVD-03 can handle one 6" wafer or one 4" wafer (or several smaller pieces) per run. PVD-05 has a large platen and can accept about four 4" wafers with good uniformity.
PVD-03 is in a sputter up configuration, which means the guns point up and the sample must be attached upside down. This is usually considered cleaner, but requires greater consideration for sample mounting. PVD-05 is in sputter down configuration, so samples can just be placed on the platen.
Magnetic materials can only be sputtered from PVD-03. PVD-05 does not have the necessary high mag sources

Deposition sources

Metals

Ag (Warning! Ag target must be cooled down for more than 15 min after deposition)
Al
Au
Co
Cr
Cu
Fe
Mn
Mo
Nb
Ni
Pd
Pt
Ti
W

Semiconductors & metalloids

Ge
Sb
Si
p-Si (boron-doped)

Oxides, fluorides & nitrides

Al₂O₃
AZO (ZnO₂/Al₂O₃; transparent conductive oxide)
ITO (indium-doped tin oxide; transparent conductive oxide)
MgF₂
MgO
NbN
Si₃N₄
SiO₂
Ta₂O₅
TiO₂
TiN

Alloys & ceramics

Al/Si (99/1)
Fe/Ge (81/19 & 83/17)
Ni/Fe
Ni/Cr (80/20)
YSZ (Yttria-stabilized zirconia)

Other targets

Please consult with staff

Important resources

Target request form

Link to Google form

SOPs & troubleshooting

SOP

PVD-03 Open Load SOP

Process data

Note: The sputter yield chart can be useful for estimating approximately what rate to expect from materials, but the rate given is highly dependent on tool configuration and is not directly relevant

@@ Line 80: / Line 80: @@
 * Please consult with staff
-== Resources ==
+== Important resources ==
-[https://docs.google.com/forms/d/e/1FAIpQLScwWE1RvqXfH9hwqrQcYDLpgN6L9uNGdaZlq5Hw3NjqXng30g/viewform Target Request Form]
+===== Target request form =====
-===== SOPs & Troubleshooting =====
+* [https://docs.google.com/forms/d/e/1FAIpQLScwWE1RvqXfH9hwqrQcYDLpgN6L9uNGdaZlq5Hw3NjqXng30g/viewform Link to Google form]
+===== SOPs & troubleshooting =====
 * [https://www.seas.upenn.edu/~nanosop/PVD75_Sputtering_SOP.htm SOP]
 * [https://upenn.box.com/s/duex4o7xnhoq4dbqoo51aaij1o1b44mk PVD-03 Open Load SOP]
-===== Process Data =====
+===== Process data =====
 * [https://upenn.box.com/s/lujbua3msga3313fntajkw3bcwh0d63w PVD-03 Recipes]
 * [https://www.angstromsciences.com/sputtering-yields Sputter Yield Chart]
 :: Note: The sputter yield chart can be useful for estimating approximately what rate to expect from materials, but the rate given is highly dependent on tool configuration and is not directly relevant