Difference between revisions of "EVG 620 Wafer Bond Aligner"
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Revision as of 13:34, 29 April 2022
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| Tool Name | EVG 620 Wafer Bond Aligner |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Eric Johnston |
| Lab Location | Bay 2 |
| Tool Manufacturer | EV Group |
| Tool Model | 620 Aligner |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
Known for its high level of automation and reliability, the EVG620 Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. The EV Group´s bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG´s bond alignment system accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
Applications
- Aligning 4" wafers for bonding in the EVG 620
- Maximum stack height: 4.5 mm
- Range of alignment: X, Y ± 5.0 mm
- Alignment accuracy:
- 0.5 um for glass/silicon
- 1.0 um for silicon/silicon
- Contact force: 1-40 N