Difference between revisions of "Oxford 80 Plus RIE"

**Oxford 80 Plus RIE**
Tool Name	Oxford 80 Plus RIE
Instrument Type	Etch
Staff Manager	Sam Azadi
Lab Location	Bay 2
Tool Manufacturer	Oxford Instruments
Tool Model	80+
NEMO Designation	{{{NEMO_Designation}}}
Lab Phone	215-898-9748
SOP Link	QNF SOP

Revision as of 10:16, 7 April 2022

Description

Oxford 80 Plus is an anisotropic dry etch tool. The main use of this tool is to etch SiO₂, and SiN_x to create hard masks for deep Si etch. However, it etches many other materials, including a variety of resists. The tool is connected to the following gases: Ar, O2, CF4, CHF3, SF6.

The plasma is ignited by the oscillating electric field created by the RF power at 13.56 MHz. The wafer is cooled down via passive cooling through a graphite chuck.

Applications

Etch of SiO2
Etch of SiNx
Etch of Si
Etch of resist

Resources

Oxford 80+ Training Video

SOPs & Troubleshooting

QNF SOP

Protocols and Reports

Reactive Ion Etching (RIE) of Silicon dioxide with tetrafluoromethane (CF₄)

Reactive Ion Etching (RIE) of Silicon nitride with tetrafluoromethane (CF₄)

@@ Line 28: / Line 28: @@
 == Resources ==
-[https://repository.upenn.edu/do/search/?q=title%3ARIE&start=0&context=19929&sort=score&facet= List of etch characterized etch processes]
 [https://www.youtube.com/watch?v=aXAcgAkQpLc Oxford 80+ Training Video]
@@ Line 35: / Line 34: @@
 ===== SOPs & Troubleshooting =====
 * [https://repository.upenn.edu/scn_sop/7/ QNF SOP]
+===== Protocols and Reports =====
+* [https://repository.upenn.edu/scn_tooldata/36/ Reactive Ion Etching (RIE) of Silicon dioxide with tetrafluoromethane (CF<sub>4</sub>)]
+* [https://repository.upenn.edu/scn_tooldata/37/ Reactive Ion Etching (RIE) of Silicon nitride with tetrafluoromethane (CF<sub>4</sub>)]