Difference between revisions of "Oxford 80 Plus RIE"
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(Created page with "Category:Etch {{EquipmentInfo | name = Oxford 80 Plus RIE | Tool_Name = Oxford 80 Plus RIE | image = 300px | imagecaption = | Instrument_Type = Etch...") |
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== Description == | == Description == | ||
| − | Oxford 80 Plus is an anisotropic dry etch tool. The main use of this tool is to etch | + | Oxford 80 Plus is an anisotropic dry etch tool. The main use of this tool is to etch SiO<sub>2</sub>, and SiN<sub>x</sub> to create hard masks for deep Si etch. However, it etches many other materials, including a variety of resists. The tool is connected to the following gases: Ar, O2, CF4, CHF3, SF6. |
The plasma is ignited by the oscillating electric field created by the RF power at 13.56 MHz. The wafer is cooled down via passive cooling through a graphite chuck. | The plasma is ignited by the oscillating electric field created by the RF power at 13.56 MHz. The wafer is cooled down via passive cooling through a graphite chuck. | ||
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* Etch of SiNx | * Etch of SiNx | ||
* Etch of Si | * Etch of Si | ||
| − | + | * Etch of resist | |
== Resources == | == Resources == | ||
Revision as of 10:10, 7 April 2022
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| Tool Name | Oxford 80 Plus RIE |
|---|---|
| Instrument Type | Etch |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 2 |
| Tool Manufacturer | Oxford Instruments |
| Tool Model | 80+ |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
Oxford 80 Plus is an anisotropic dry etch tool. The main use of this tool is to etch SiO2, and SiNx to create hard masks for deep Si etch. However, it etches many other materials, including a variety of resists. The tool is connected to the following gases: Ar, O2, CF4, CHF3, SF6.
The plasma is ignited by the oscillating electric field created by the RF power at 13.56 MHz. The wafer is cooled down via passive cooling through a graphite chuck.
Applications
- Etch of SiO2
- Etch of SiNx
- Etch of Si
- Etch of resist
Resources
List of etch characterized etch processes