Difference between revisions of "Lesker Nano-36 Thermal Evaporator"

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(Created page with "Category:Deposition {{EquipmentInfo | name = Lesker Nano-36 Thermal Evaporator | Tool_Name = Lesker Nano-36 Thermal Evaporator | image = 300px | ima...")
 
 
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[[Category:Deposition]]
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[[Category:Deposition]][[Category:Physical Vapor Deposition]][[Category:Evaporation]][[Category:Equipment]]
  
 
{{EquipmentInfo
 
{{EquipmentInfo
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| imagecaption =  
 
| imagecaption =  
 
| Instrument_Type = Deposition
 
| Instrument_Type = Deposition
| Staff_Manager = David Barth
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| Staff_Manager = [[David Barth | David Barth]]
 
| Lab_Location = Bay 2
 
| Lab_Location = Bay 2
 
| Tool_Manufacturer = Kurt J. Lesker
 
| Tool_Manufacturer = Kurt J. Lesker
 
| Tool_Model = Nano-36
 
| Tool_Model = Nano-36
| Iris_Designation = PVD-01
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| NEMO_Designation = PVD-01
| Lab_Phone = XXXXX
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| Lab_Phone = 215-898-9748
 
| SOP Link = [https://www.seas.upenn.edu/~nanosop/Nano36_SOP SOP]
 
| SOP Link = [https://www.seas.upenn.edu/~nanosop/Nano36_SOP SOP]
 
}}
 
}}
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== Description ==
 
== Description ==
  
The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-sit by a thickness monitor. Up to four different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination. The wafer platen can accommodate sizes up to 150 mm.  
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The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-situ by a thickness monitor. Up to three different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination. The wafer platen can accommodate sizes up to 150 mm.  
  
  
===== Films =====
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===== Deposition Sources =====
* Ti
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* Ni
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The tool is primarily used for deposition of indium and other materials whose vapor pressure or other properties make them unsuitable for other chambers (such as tin). Most materials are allowed in this tool. Please discuss with staff before beginning any new process in the tool.
* Cr
 
* Fe
 
* Pb
 
* NiCr
 
* Deposition of other films can be made available upon request
 
  
 
== Resources ==
 
== Resources ==
  
 
===== SOPs & Troubleshooting =====
 
===== SOPs & Troubleshooting =====
* [https://www.seas.upenn.edu/~nanosop/Nano36_SOP QNF SOP]
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Link: [https://nemo.nano.upenn.edu/media/tool_documents/pvd-01-nano-36-thermal/PVD-01_SOP_New_V1.docx.pdf SOP]
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<pdf height="800">File:PVD-01_SOP_New_V1.pdf</pdf>
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===== Materials vapor-pressure =====
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* [https://www.powerstream.com/vapor-pressure.htm PowerStream website]

Latest revision as of 11:39, 12 November 2025


Lesker Nano-36 Thermal Evaporator
PVD-01.jpeg
Tool Name Lesker Nano-36 Thermal Evaporator
Instrument Type Deposition
Staff Manager David Barth
Lab Location Bay 2
Tool Manufacturer Kurt J. Lesker
Tool Model Nano-36
NEMO Designation PVD-01
Nearest Phone 215-898-9748
SOP Link SOP

Description

The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-situ by a thickness monitor. Up to three different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination. The wafer platen can accommodate sizes up to 150 mm.


Deposition Sources

The tool is primarily used for deposition of indium and other materials whose vapor pressure or other properties make them unsuitable for other chambers (such as tin). Most materials are allowed in this tool. Please discuss with staff before beginning any new process in the tool.

Resources

SOPs & Troubleshooting

Link: SOP

Materials vapor-pressure