Difference between revisions of "CEE 200X Spinner"
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| − | [[Category: | + | [[Category:Backend & Packaging]][[Category:Equipment]] |
{{EquipmentInfo | {{EquipmentInfo | ||
| − | | name = Spinner | + | | name = CEE 200X Spinner |
| − | | Tool_Name = Spinner | + | | Tool_Name = CEE 200X Spinner |
| − | | image = [[Image: | + | | image = [[Image:SPN-07.png |300px]] |
| imagecaption = | | imagecaption = | ||
| − | | Instrument_Type = | + | | Instrument_Type = Back End |
| − | | Staff_Manager = | + | | Staff_Manager = [[Travis Venables | Travis Venables]] |
| − | | Lab_Location = | + | | Lab_Location = Singh 124 |
| Tool_Manufacturer = CEE | | Tool_Manufacturer = CEE | ||
| − | | Tool_Model = | + | | Tool_Model = 200X |
| − | | | + | | NEMO_Designation = SPN-07 |
| Lab_Phone = 3-9639 | | Lab_Phone = 3-9639 | ||
| SOP Link = [https://repository.upenn.edu/scn_sop/10/ SOP] | | SOP Link = [https://repository.upenn.edu/scn_sop/10/ SOP] | ||
| Line 17: | Line 17: | ||
== Description == | == Description == | ||
| − | Spinner for coating substrates with | + | Spinner for coating substrates with protective coatings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step. |
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== Resources == | == Resources == | ||
Latest revision as of 12:39, 28 July 2025
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| Tool Name | CEE 200X Spinner |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Travis Venables |
| Lab Location | Singh 124 |
| Tool Manufacturer | CEE |
| Tool Model | 200X |
| NEMO Designation | SPN-07 |
| Nearest Phone | 3-9639 |
| SOP Link | SOP |
Description
Spinner for coating substrates with protective coatings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step.