Difference between revisions of "CEE 200X Spinner"
Jump to navigation
Jump to search
(update name) |
m |
||
| (3 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
| − | [[Category: | + | [[Category:Backend & Packaging]][[Category:Equipment]] |
{{EquipmentInfo | {{EquipmentInfo | ||
| Line 7: | Line 7: | ||
| imagecaption = | | imagecaption = | ||
| Instrument_Type = Back End | | Instrument_Type = Back End | ||
| − | | Staff_Manager = [[ | + | | Staff_Manager = [[Travis Venables | Travis Venables]] |
| Lab_Location = Singh 124 | | Lab_Location = Singh 124 | ||
| Tool_Manufacturer = CEE | | Tool_Manufacturer = CEE | ||
| Line 17: | Line 17: | ||
== Description == | == Description == | ||
| − | Spinner for coating substrates with | + | Spinner for coating substrates with protective coatings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step. |
== Resources == | == Resources == | ||
Latest revision as of 12:39, 28 July 2025
 |
|
| Tool Name | CEE 200X Spinner |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Travis Venables |
| Lab Location | Singh 124 |
| Tool Manufacturer | CEE |
| Tool Model | 200X |
| NEMO Designation | SPN-07 |
| Nearest Phone | 3-9639 |
| SOP Link | SOP |
Description
Spinner for coating substrates with protective coatings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step.