Difference between revisions of "CEE 200X Spinner"
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== Description == | == Description == | ||
| − | Spinner for coating substrates with | + | Spinner for coating substrates with protective coatings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step. |
== Resources == | == Resources == | ||
Revision as of 14:25, 25 July 2025
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| Tool Name | CEE 200X Spinner |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Travis Venables |
| Lab Location | Singh 124 |
| Tool Manufacturer | CEE |
| Tool Model | 200X |
| NEMO Designation | SPN-07 |
| Nearest Phone | 3-9639 |
| SOP Link | SOP |
Description
Spinner for coating substrates with protective coatings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step.