Difference between revisions of "SUSS MicroTec AS8 AltaSpray"

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== Resources ==
 
== Resources ==
 +
 +
===== SOPs & Troubleshooting =====
 +
* [https://nemo.nano.upenn.edu/media/tool_documents/rc-01-suss-spray-coater/RC-01_SOP_v01.pdf QNF SOP]
 +
* [https://upenn.box.com/s/gn8plnqgwwdn948zo0pywwnm0i1s93y4 AS8 Spray Coater Reboot Procedure]
  
 
===== Process characterization and tool data =====  
 
===== Process characterization and tool data =====  
 
* [https://repository.upenn.edu/scn_tooldata/46/ Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater]
 
* [https://repository.upenn.edu/scn_tooldata/46/ Influence of flow rate, nozzle speed, pitch and the number of passes on the thickness of S1805 photoresist in SUSS MicroTec AS8 spray coater]
  
 
+
===== About spray-coating =====
===== SOPs & Troubleshooting =====
+
* [https://www.microchemicals.com/dokumente/application_notes/spray_coating_photoresist.pdf Basics - MicroChemicals]
* [https://nemo.nano.upenn.edu/media/tool_documents/rc-01-suss-spray-coater/RC-01_SOP_v01.pdf QNF SOP]
 
* [https://upenn.box.com/s/gn8plnqgwwdn948zo0pywwnm0i1s93y4 AS8 Spray Coater Reboot Procedure]
 

Revision as of 14:40, 24 July 2025


SUSS MicroTec AS8 AltaSpray
RC-01.jpeg
Tool Name SUSS MicroTec AS8 AltaSpray
Instrument Type Lithography
Staff Manager Ana Cohen
Lab Location Bay 5
Tool Manufacturer SUSS MicroTec
Tool Model AS8 AltaSpray
NEMO Designation RC-01
Nearest Phone XXXXX
SOP Link SOP

Description

SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm.

Applications
  • Automated resist spray coater for high topographies


Resources

SOPs & Troubleshooting
Process characterization and tool data
About spray-coating