Difference between revisions of "Intlvac E-beam Evaporator"
Jump to navigation
Jump to search
(4 intermediate revisions by the same user not shown) | |||
Line 13: | Line 13: | ||
| NEMO_Designation = PVD-09 | | NEMO_Designation = PVD-09 | ||
| Lab_Phone = 215-898-9748 | | Lab_Phone = 215-898-9748 | ||
− | | SOP Link = [https:// | + | | SOP Link = [https://nemo.nano.upenn.edu/media/tool_documents/pvd-09-intlvac-evap/PVD09_SOP_v01.docx.pdf SOP] |
}} | }} | ||
Line 19: | Line 19: | ||
===== The tool ===== | ===== The tool ===== | ||
− | The IntlVac Electron Beam Evaporator has a base process chamber pressure in the e-8 Torr range with substrate heating and ozone purging capabilities. Deposition rates are monitored by an automated magazine of 6MHz crystals. The tool can be used to process a single 4 inch wafer at a time or a selection of small chips/pieces. | + | The IntlVac Electron Beam Evaporator has a base process chamber pressure in the low e-8 Torr range with substrate heating and ozone purging capabilities. Deposition rates are monitored by an automated magazine of 6MHz crystals. The tool can be used to process a single 4 inch wafer at a time or a selection of small chips/pieces. |
===== Available materials ===== | ===== Available materials ===== | ||
Line 31: | Line 31: | ||
===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
− | + | * [https://nemo.nano.upenn.edu/media/tool_documents/pvd-09-intlvac-evap/PVD09_SOP_v01.docx.pdf PVD-09 SOP] |
Latest revision as of 15:46, 20 September 2024
Tool Name | Intlvac E-Beam Evaporator |
---|---|
Instrument Type | Physical vapor deposition |
Staff Manager | David Barth |
Lab Location | Bay 2 |
Tool Manufacturer | Intlvac |
Tool Model | Nanochrome |
NEMO Designation | PVD-09 |
Lab Phone | 215-898-9748 |
SOP Link | SOP |
Description
The tool
The IntlVac Electron Beam Evaporator has a base process chamber pressure in the low e-8 Torr range with substrate heating and ozone purging capabilities. Deposition rates are monitored by an automated magazine of 6MHz crystals. The tool can be used to process a single 4 inch wafer at a time or a selection of small chips/pieces.
Available materials
The tool contains the following materials:
- Al - Aluminum
- Ti - Titanium