Difference between revisions of "CEE 200X Spinner"
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| image = [[Image:SPN-07.png |300px]] | | image = [[Image:SPN-07.png |300px]] | ||
| imagecaption = | | imagecaption = | ||
| − | | Instrument_Type = | + | | Instrument_Type = Back End |
| Staff_Manager = [[Ana Cohen | Ana Cohen]] | | Staff_Manager = [[Ana Cohen | Ana Cohen]] | ||
| − | | Lab_Location = | + | | Lab_Location = Singh 124 |
| Tool_Manufacturer = CEE | | Tool_Manufacturer = CEE | ||
| Tool_Model = 200X | | Tool_Model = 200X | ||
Revision as of 14:59, 12 March 2024
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| Tool Name | Spinner - SU8/PDMS |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Ana Cohen |
| Lab Location | Singh 124 |
| Tool Manufacturer | CEE |
| Tool Model | 200X |
| NEMO Designation | SPN-07 |
| Nearest Phone | 3-9639 |
| SOP Link | SOP |
Description
Spinner for coating substrates with resists and protective coverings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step.