Ti (titanium)

Titanium is a transition metal with atomic number 22 and symbol Ti. Titanium has a low density, high strength and is resistant to corrosion by water. It has relatively poor electrical and thermal conduction compared to most metals.

Equipment

Deposition Equipment

PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
PVD-03: Lesker PVD75 DC/RF Sputterer
PVD-04: Lesker PVD75 E-beam Evaporator
PVD-05: Denton Explorer14 Magnetron Sputterer

Etching

Applications

Processes

Sputter Deposition Rates

PVD Tool	Cathode 2 (DC; high mag)			Recorded	Cathode 3 (DC)			Recorded	Cathode 4 (DC; high mag)			Recorded
PVD Tool	Pressure	Power	Rate	Recorded	Pressure	Power	Rate	Recorded	Pressure	Power	Rate	Recorded
PVD-03	6 mTorr	300 W	1.8 Å s^-1		5 mTorr	300 W	0.98 Å s^-1	03/06/23	6 mTorr	300 W	0.8 Å s^-1

PVD Tool	Cathode 2 (DC)			Recorded
PVD Tool	Pressure	Power	Rate	Recorded
PVD-05	3 mTorr	350 W	2.0 Å s^-1

PVD-05 Master Recipe:

Step T004 is the deposition step and step T005 is the cool-down step (60 s).

Step Number	T000	T001	T002	T003	T004	T005	T006
Step Time (sec)	5	120	60	60	[dep]	60	5
Min Vacuum Setpoint (Torr)

Gas - (PID or Fixed)		PID	PID	PID	PID
Gas - PID Master Gas Select		1	1	1	1
Gas1 - Setpoint (sccm)		10	10	10	10
Gas2 - Setpoint (sccm)

Gas PID Pressure (mTorr)		10	5	3	3
RF Source - Sputter (Watts)
RF Source - Cathode Select
RF Source - Shutter
DC 1 Source - Sputter (Watts)		100	200	300	350
DC 1 Source - Cathode Select		2	2	2	2
DC 1 Source - Shutter					Open
DC 2 Source - Sputter (Watts)

DC 2 Source - Shutter
Pressure Control (Throttle)	Yes	Yes	Yes	Yes	Yes
Ignition Pressure (mTorr)

Rotation Speed (0-100%)	50	50	50	50	50
End Process (Yes)							Yes