Difference between revisions of "SUSS MicroTec AS8 AltaSpray"
Jump to navigation
Jump to search
(update tool owner) |
|||
| Line 7: | Line 7: | ||
| imagecaption = | | imagecaption = | ||
| Instrument_Type = Lithography | | Instrument_Type = Lithography | ||
| − | | Staff_Manager = | + | | Staff_Manager = [[Ana Cohen | Ana Cohen]] |
| Lab_Location = Bay 2 | | Lab_Location = Bay 2 | ||
| Tool_Manufacturer = SUSS MicroTec | | Tool_Manufacturer = SUSS MicroTec | ||
Revision as of 13:49, 3 January 2024
 |
|
| Tool Name | SUSS MicroTec AS8 AltaSpray |
|---|---|
| Instrument Type | Lithography |
| Staff Manager | Ana Cohen |
| Lab Location | Bay 2 |
| Tool Manufacturer | SUSS MicroTec |
| Tool Model | AS8 AltaSpray |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm.
Applications
- Automated resist spray coater for high topographies
Resources
Process characterization and tool data