Difference between revisions of "Oxford PlasmaLab 100 PECVD"
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| Line 12: | Line 12: | ||
| Tool_Model = PlasmaLab 100 | | Tool_Model = PlasmaLab 100 | ||
| Iris_Designation = CVD-01 | | Iris_Designation = CVD-01 | ||
| − | | Lab_Phone = | + | | Lab_Phone = 215-898-9736 |
| SOP Link = [https://repository.upenn.edu/scn_sop/5/ QNF SOP] | | SOP Link = [https://repository.upenn.edu/scn_sop/5/ QNF SOP] | ||
}} | }} | ||
Revision as of 10:54, 7 April 2022
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| Tool Name | Oxford PlasmaLab 100 PECVD |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 1 |
| Tool Manufacturer | Oxford |
| Tool Model | PlasmaLab 100 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | 215-898-9736 |
| SOP Link | QNF SOP |
Description
The QNF Oxford Instruments PlasmaLab System 100 Plasma Enhanced Chemical Vapor Deposition (PECVD) tool is used to deposit a variety of thin-film materials at relatively modest temperatures on a variety of substrate materials. The tool utilizes an RF generator to deposit thin films at temperatures lower than traditional chemical vapor deposition systems.
Applications
- Silicon dioxide deposition
- Silicon nitride deposition
- Amorphous silicon deposition
Allowed material in PECVD System
- Si, SixNy, SiO2, SOI
- Hard masks compatible with process temperature
Resources
SOPs & Troubleshooting