Difference between revisions of "Oxford PlasmaLab 100 PECVD"
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===== Applications ===== | ===== Applications ===== | ||
| − | |||
* Silicon dioxide deposition | * Silicon dioxide deposition | ||
| − | * | + | * Silicon nitride deposition |
| − | * | + | * Amorphous silicon deposition |
| − | |||
===== Allowed material in PECVD System ===== | ===== Allowed material in PECVD System ===== | ||
Revision as of 10:22, 7 April 2022
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| Tool Name | Oxford PlasmaLab 100 PECVD |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 2 |
| Tool Manufacturer | Oxford |
| Tool Model | PlasmaLab 100 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | [1] |
Description
The QNF Savannah ALD is equipped with high-speed pneumatic pulse valves to enable our unique Exposure Mode™ for thin film deposition on ultra high aspect ratio substrates. This proven precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than > 2000:1.
The QNF Savannah ALD is capable of holding substrates of different sizes (up to 200mm). The system is equipped with six precursor lines for deposition of Al2O3, HfO2, TiO2, and SiO2.
Applications
- Silicon dioxide deposition
- Silicon nitride deposition
- Amorphous silicon deposition
Allowed material in PECVD System
- Si, SixNy, SiO2, SOI
- Hard masks compatible with process temperature
Resources
SOPs & Troubleshooting