Difference between revisions of "Lesker Nano-36 Thermal Evaporator"

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== Description ==
 
== Description ==
  
The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-sit by a thickness monitor. Up to four different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination. The wafer platen can accommodate sizes up to 150 mm.  
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The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-situ by a thickness monitor. Up to three different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination. The wafer platen can accommodate sizes up to 150 mm.  
  
  
 
===== Deposition Sources =====
 
===== Deposition Sources =====
* Ti
+
 
* Ni
+
The tool is primarily used for deposition of indium and other materials whose vapor pressure or other properties make them unsuitable for other chambers. Most materials are allowed in this tool. Please discuss with staff before beginning any new process in the tool.
* Cr
 
* Fe
 
* Pb
 
* NiCr
 
* Deposition of other films can be made available upon request
 
  
 
== Resources ==
 
== Resources ==

Revision as of 15:08, 29 April 2022


Lesker Nano-36 Thermal Evaporator
PVD-01.jpeg
Tool Name Lesker Nano-36 Thermal Evaporator
Instrument Type Deposition
Staff Manager David Barth
Lab Location Bay 2
Tool Manufacturer Kurt J. Lesker
Tool Model Nano-36
NEMO Designation {{{NEMO_Designation}}}
Lab Phone XXXXX
SOP Link SOP

Description

The Kurt J. Lesker Nano36 will evaporate a metal film under high vacuum while measuring the thickness in-situ by a thickness monitor. Up to three different materials can be loaded in one batch, and the evaporation sources are sufficiently isolated from each other by shields to prevent cross contamination. The wafer platen can accommodate sizes up to 150 mm.


Deposition Sources

The tool is primarily used for deposition of indium and other materials whose vapor pressure or other properties make them unsuitable for other chambers. Most materials are allowed in this tool. Please discuss with staff before beginning any new process in the tool.

Resources

SOPs & Troubleshooting