Difference between revisions of "IPG IX280-DXF Green Micromachining Laser"
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| imagecaption = | | imagecaption = | ||
| Instrument_Type = Back End | | Instrument_Type = Back End | ||
| − | | Staff_Manager = | + | | Staff_Manager = [[Ana Cohen | Ana Cohen]] |
| − | | Lab_Location = | + | | Lab_Location = Singh 124 |
| Tool_Manufacturer = IPG | | Tool_Manufacturer = IPG | ||
| Tool_Model = IX280 | | Tool_Model = IX280 | ||
| − | | | + | | NEMO_Designation = LMM-02 |
| Lab_Phone = 3-9639 | | Lab_Phone = 3-9639 | ||
| SOP Link = [https://repository.upenn.edu/scn_protocols/75 SOP] | | SOP Link = [https://repository.upenn.edu/scn_protocols/75 SOP] | ||
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* [https://repository.upenn.edu/scn_protocols/75 QNF SOP] | * [https://repository.upenn.edu/scn_protocols/75 QNF SOP] | ||
* [LMM-02_Green_Laser_Troubleshooting Troubleshooting] | * [LMM-02_Green_Laser_Troubleshooting Troubleshooting] | ||
| + | * [https://docs.google.com/document/d/1rA45VyNiVdDZmiUbjQior4wT9KM7wszDq2Es_0fjGA0/edit?usp=sharing Procedure for Disabled Z-Drive] | ||
Latest revision as of 16:01, 12 March 2024
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| Tool Name | IPG IX280-DXF Green Micromachining Laser |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Ana Cohen |
| Lab Location | Singh 124 |
| Tool Manufacturer | IPG |
| Tool Model | IX280 |
| NEMO Designation | LMM-02 |
| Lab Phone | 3-9639 |
| SOP Link | SOP |
Description
The IX280-DXF is a highly flexible laser micro-machining system for multipurpose, R&D and production applications. The system combines a Class 1 workstation integrated with a fiber laser and all necessary software.
Specifications
- Model: 115-4-A15834
- Serial Number: 32826
- Lasers at 532 or 1064 nm
- Pulse Energy up to 15 Joules (1064 nm)
- X-Y Positional Accuracy: <3 μm
- Z-theta Accuracy: <10 μm, ±0.02°
- Galvanometer Scanner or Fixed Optics
- Galvo model: IntelliSCAN14
- Galvo serial number: 411365
- Step and Scan Stage/ Galvo Integration
- Vision System Resolution 0.12 μm/ pixel
- DXF and DWG drawing files accepted
Applications
Cutting Applications
- Ceramics, Metals, Polymers and Semiconductor Materials
- Patterning of ITO and other Thin-films
Drilling Applications
- Hole Diameters down to 15 μm
For rectangular through cuts, put the horizontal and vertical cuts on a separate layer and run them separately (as shown in image below). The cuts should be about 100um wide and set up as a fill per the SOP.
Resources
SOPs & Troubleshooting
- QNF SOP
- [LMM-02_Green_Laser_Troubleshooting Troubleshooting]
- Procedure for Disabled Z-Drive