Equipment

From Quattrone Nanofabrication Facility
Revision as of 17:01, 25 March 2022 by Ericdj (talk | contribs)
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Deposition

Evaporation
  • Lesker Nano-36 Thermal Evaporator
  • Lesker PVD75 E-Beam/Thermal Evaporator
  • Lesker PVD75 E-beam Evaporator
Sputtering
  • Lesker PVD75 DC/RF Sputterer
  • Denton Explorer14 Magnetron Sputterer
Chemical Vapor Deposition (CVD)

Etch

Plasma Etch
  • Anatech SCE-108 Barrel Asher
  • SPTS Si DRIE
  • Oxford 80 Plus RIE
  • Oxford Cobra ICP Etcher
  • Jupiter II RIE Plasma Etcher

Vapor / Wet Etch

  • SPTS/Xactix XeF2 Isotropic Etcher

Lithography

E-beam Lithography

Laser Lithography

  • Heidelberg DWL 66+ Laser Writer
  • Nanoscribe Photonic Professional GT

Photolithography

  • SUSS MicroTec MA6 Gen3 Mask Aligner

Imprint Lithography

  • Nanonex NX2600 Nanoimprint

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

  • Anatech SCE-106 Barrel Asher
  • ABM3000HR Mask Aligner
  • SCS PDS2010 Parylene Coater
  • Silanization Dessicator
  • Spinner - SU-8/PDMS

Metrology

  • KLA Tencor P7 2D profilometer
  • KLA Tencor P7 2D&3D/stress profilometer
  • Filmetrics F50 (yellow light)
  • Filmetrics F40
  • Zygo NewView 7300 Optical Profilometer
  • Woollam VAS Ellipsometer
  • Jandel Multi Height Four Point Probe
  • Micromanipulator 4060 Probe Station
  • Filmetrics F50 (white light)
  • Zeiss Axio Imager M2m Microscopes

Backend & Packaging

  • IPG IX-255 Excimer Micromachining Laser
  • IPG IX280-DXF Green Micromachining Laser
  • EVG 510 Wafer Bonder
  • EVG 620 Wafer Bond Aligner
  • K&S Wire Bonder
  • ADT 7100 Dicing Saw
  • Tousimis Critical Point Dryer
  • Dimatix ink-Jet Printer

Thermal Processing

  • MPT Corp. RTP-600S Rapid Thermal Annealer
  • MRL Anneal Furnace 1
  • MRL Anneal Furnace 2