Difference between revisions of "EVG 510 Wafer Bonder"
Jump to navigation
Jump to search
| Line 8: | Line 8: | ||
| Instrument_Type = Back End | | Instrument_Type = Back End | ||
| Staff_Manager = Eric Johnston | | Staff_Manager = Eric Johnston | ||
| − | | Lab_Location = Bay | + | | Lab_Location = Bay 4 |
| Tool_Manufacturer = EV Group | | Tool_Manufacturer = EV Group | ||
| Tool_Model = 510 | | Tool_Model = 510 | ||
Revision as of 13:59, 9 February 2023
 |
|
| Tool Name | EVG 510 Wafer Bonder |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Eric Johnston |
| Lab Location | Bay 4 |
| Tool Manufacturer | EV Group |
| Tool Model | 510 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
The EVG510 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 100 mm wafers. The new tool supports a variety of bonding processes, such as anodic, eutectic, diffusion, fusion, solder, and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than five minutes, making it ideal for universities and R&D as well as small-volume production applications.
Specification Maximum contact force: 10 kN Maximum temperature: 550 ºC Vacuum: ~0.1 mbar Power supply for anodic bonding: 0-2000 V and 50 mA
Applications
- Anodic wafer bonding
- Eutectic wafer bonding
- Diffusion wafer bonding
- Fusion wafer bonding
- Adhesive wafer bonding