Denton Explorer14 Magnetron Sputterer

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Denton Explorer14 Magnetron Sputterer
PVD-05.jpeg
Tool Name Denton Explorer14 Magnetron Sputterer
Instrument Type Deposition
Staff Manager Jason (jarohr@seas.upenn.edu)
Lab Location Bay 2
Tool Manufacturer Denton
Tool Model Explorer14
NEMO Designation {{{NEMO_Designation}}}
Lab Phone 215-898-9748
SOP Link SOP

Description

The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs.

The tool is an open load system in sputter-down configuration with one dedicated DC gun and two guns that can use either a DC or RF power supply. Codeposition from two DC sources or one DC and one RF source is possible. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.

Maximum DC Power is 600 W.

Maximum RF Power is 200 W.


Deposition Sources
  • ITO
  • Cr
  • Ti
  • Ni
  • Cu
  • Al
  • SiO2
  • Ge
  • Pt
  • Au
  • Ag
  • Pd
  • Si
  • Al2O3
  • Mo
  • Various others - please contact staff

Available materials & process data

  • All process data were recorded at a base pressure lower than 5 x 10-6 Torr; you can never exceed 200 W on RF and 600 W on DC.
Material Name Max power Process data Recorded
Pressure Power Rate
Ag (silver) 450 W 3 mTorr 140 W 7.3 Å s-1
Al (aluminum) 450 W 3 mTorr 200 W 3.0 Å s-1
Au (gold) 140 W 3 mTorr 140 W 4.6 Å s-1
Cr (chromium) 450 W - - -
Cu (copper) 450 W 3 mTorr 400 W 3.4 Å s-1
Fe (iron) 350 W - - -
Ge (germanium) 140 W - - -
ITO (Indium tin oxide) 140 W - - -
Mn (manganese) 140 W - - -
Mo (molybdenum) 450 W 3 mTorr 140 1.9 Å s-1
Ni (nickel) 350 W - - -
Pd (palladium) 140 W - - -
Pt (platinum) 140 W 3 mTorr 140 W 2.6 Å s-1
i-Si (intrinsic silicon) 140 W - - -
n-Si (n-type silicon) 280 W - - -
p-Si (p-type silicon) 280 W - - -
Ti (titanium) 350 W 3 mTorr 350 W 2.0 Å s-1
TiO2 (titanium dioxide) 140 W - - -
W (tungsten) 450 W - - -
YSZ (yttria-stabilized zirconia) 140 W - - -

Resources

SOPs & Troubleshooting

Master recipes

Coming soon

Step Number T000 T001 T002 T003 T004 T005 T006
Step Time (sec) - - - - - - -
Min Vacuum Setpoint (Torr) - - - - - - -
Gas - (PID or Fixed) - - - - - - -
Gas - PID Master Gas Select - - - - - - -
Gas1 - Setpoint (sccm) - - - - - - -
Gas2 - Setpoint (sccm) - - - - - - -
Gas PID Pressure (mTorr) - - - - - - -
RF Source - Sputter (Watts) - - - - - - -
RF Source - Cathode Select - - - - - - -
RF Source - Shutter - - - - - - -
DC 1 Source - Sputter (Watts) - - - - - - -
DC 1 Source - Cathode Select - - - - - - -
DC 1 Source - Shutter - - - - - - -
DC 2 Source - Sputter (Watts) - - - - - - -
DC 2 Source - Shutter - - - - - - -
Pressure Control (Throttle) - - - - - - -
Ignition Pressure (mTorr) - - - - - - -
Rotation Speed (0-100%) - - - - - - -
End Process (Yes) - - - - - - -