Difference between revisions of "Denton Explorer14 Magnetron Sputterer"

From Quattrone Nanofabrication Facility
Jump to navigation Jump to search
Line 47: Line 47:
 
===== Maximum Allowed Deposition Power =====
 
===== Maximum Allowed Deposition Power =====
  
=====Material name                 Target         Max allowed power [W]=====
+
{| class="wikitable" style="width: 90%;"
*Silver                         *Ag         *450
+
|-
*Aluminum                 Al         450
+
!scope="col" style="text-align:left; width: 15%"| Material Name
*Gold                         Au         140
+
!scope="col" style="text-align:left; width: 16%" | Target
*Chromium                 Cr         450
+
!scope="col" style="text-align:left; width: 18%"| Maximum Allowed Power [W]
*Copper                         Cu         450
+
|-
*Iron                         Fe         350
+
 
*Germanium                 Ge         140
+
{{TargetTableItem|
*Indium Tin Oxide         ITO         140
+
|Material Name = Silver
*Manganese                 Mn         140
+
|Target = Ag
*Molybdenum                 Mo         450
+
|Maxium Allowed Power [W] = 450
*Nickle                         Ni              350
+
}}
*Palladium                 Pd         140
+
 
*Platinum                 Pt         140
+
|}
*Silicon - doped                 Si (doped) 280
+
 
*Silicon - undoped         Si (undoped) 140
+
 
*Titanium                 Ti         350
 
*Titanium oxide                 TiO2         140
 
*Tungsten                 W         450
 
*Yttria Stabilized Zirconia YSZ         140
 
  
 
== Resources ==
 
== Resources ==

Revision as of 16:19, 5 May 2022


Denton Explorer14 Magnetron Sputterer
PVD-05.jpeg
Tool Name Denton Explorer14 Magnetron Sputterer
Instrument Type Deposition
Staff Manager Sam Azadi
Lab Location Bay 2
Tool Manufacturer Denton
Tool Model Explorer14
NEMO Designation {{{NEMO_Designation}}}
Lab Phone XXXXX
SOP Link SOP

Description

The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs.

The tool is an open load system in sputter-down configuration with one dedicated DC gun and two guns that can use either a DC or RF power supply. Codeposition from two DC sources or one DC and one RF source is possible. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.

Maximum DC Power is 600 W.

Maximum RF Power is 200 W.


Deposition Sources
  • ITO
  • Cr
  • Ti
  • Ni
  • Cu
  • Al
  • SiO2
  • Ge
  • Pt
  • Au
  • Ag
  • Pd
  • Si
  • Al2O3
  • Mo
  • Various others - please contact staff


Maximum Allowed Deposition Power
Template:TargetTableItem
Material Name Target Maximum Allowed Power [W]


Resources

SOPs & Troubleshooting