Difference between revisions of "Denton Explorer14 Magnetron Sputterer"
| Line 47: | Line 47: | ||
===== Maximum Allowed Deposition Power ===== | ===== Maximum Allowed Deposition Power ===== | ||
| − | Material name Target Max allowed power [W] | + | ==Material name Target Max allowed power [W]== |
| − | Silver Ag 450 | + | *Silver Ag 450 |
| − | Aluminum Al 450 | + | *Aluminum Al 450 |
| − | Gold Au 140 | + | *Gold Au 140 |
| − | Chromium Cr 450 | + | *Chromium Cr 450 |
| − | Copper Cu 450 | + | *Copper Cu 450 |
| − | Iron Fe 350 | + | *Iron Fe 350 |
| − | Germanium Ge 140 | + | *Germanium Ge 140 |
| − | Indium Tin Oxide ITO 140 | + | *Indium Tin Oxide ITO 140 |
| − | Manganese Mn 140 | + | *Manganese Mn 140 |
| − | Molybdenum Mo 450 | + | *Molybdenum Mo 450 |
| − | Nickle Ni 350 | + | *Nickle Ni 350 |
| − | Palladium Pd 140 | + | *Palladium Pd 140 |
| − | Platinum Pt 140 | + | *Platinum Pt 140 |
| − | Silicon - doped Si (doped) 280 | + | *Silicon - doped Si (doped) 280 |
| − | Silicon - undoped Si (undoped) 140 | + | *Silicon - undoped Si (undoped) 140 |
| − | Titanium Ti 350 | + | *Titanium Ti 350 |
| − | Titanium oxide TiO2 140 | + | *Titanium oxide TiO2 140 |
| − | Tungsten W 450 | + | *Tungsten W 450 |
| − | Yttria Stabilized Zirconia YSZ 140 | + | *Yttria Stabilized Zirconia YSZ 140 |
== Resources == | == Resources == | ||
Revision as of 16:12, 5 May 2022
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| Tool Name | Denton Explorer14 Magnetron Sputterer |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | Sam Azadi |
| Lab Location | Bay 2 |
| Tool Manufacturer | Denton |
| Tool Model | Explorer14 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs.
The tool is an open load system in sputter-down configuration with one dedicated DC gun and two guns that can use either a DC or RF power supply. Codeposition from two DC sources or one DC and one RF source is possible. The tool is equipped with a cryo-pump, with an automated interface, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.
Maximum DC Power is 600 W.
Maximum RF Power is 200 W.
Deposition Sources
- ITO
- Cr
- Ti
- Ni
- Cu
- Al
- SiO2
- Ge
- Pt
- Au
- Ag
- Pd
- Si
- Al2O3
- Mo
- Various others - please contact staff
Maximum Allowed Deposition Power
Material name Target Max allowed power [W]
- Silver Ag 450
- Aluminum Al 450
- Gold Au 140
- Chromium Cr 450
- Copper Cu 450
- Iron Fe 350
- Germanium Ge 140
- Indium Tin Oxide ITO 140
- Manganese Mn 140
- Molybdenum Mo 450
- Nickle Ni 350
- Palladium Pd 140
- Platinum Pt 140
- Silicon - doped Si (doped) 280
- Silicon - undoped Si (undoped) 140
- Titanium Ti 350
- Titanium oxide TiO2 140
- Tungsten W 450
- Yttria Stabilized Zirconia YSZ 140