Difference between revisions of "CEE 200X Spinner"
Jump to navigation
Jump to search
(Update group name, location) |
|||
| (One intermediate revision by the same user not shown) | |||
| Line 1: | Line 1: | ||
| − | [[Category: | + | [[Category:Back End]] |
{{EquipmentInfo | {{EquipmentInfo | ||
| − | | name = Spinner | + | | name = CEE 200X Spinner |
| − | | Tool_Name = Spinner | + | | Tool_Name = CEE 200X Spinner |
| image = [[Image:SPN-07.png |300px]] | | image = [[Image:SPN-07.png |300px]] | ||
| imagecaption = | | imagecaption = | ||
Latest revision as of 16:13, 12 March 2024
 |
|
| Tool Name | CEE 200X Spinner |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Ana Cohen |
| Lab Location | Singh 124 |
| Tool Manufacturer | CEE |
| Tool Model | 200X |
| NEMO Designation | SPN-07 |
| Lab Phone | 3-9639 |
| SOP Link | SOP |
Description
Spinner for coating substrates with resists and protective coverings for laser-cutting and dicing. Can also be used to apply PDMS. Control of ramp rate and speed. Includes wafer centering step.