Difference between revisions of "ADT 7100 Dicing Saw"
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(Created page with "Category:Back End {{EquipmentInfo | name = ADT 7100 Dicing Saw | Tool_Name = ADT 7100 Dicing Saw | image = 300px | imagecaption = | Instrument_Type...") |
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| SOP Link = [https://repository.upenn.edu/scn_sop/17/ SOP] | | SOP Link = [https://repository.upenn.edu/scn_sop/17/ SOP] | ||
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===== SOPs & Troubleshooting ===== | ===== SOPs & Troubleshooting ===== | ||
* [https://repository.upenn.edu/scn_sop/17/ QNF SOP] | * [https://repository.upenn.edu/scn_sop/17/ QNF SOP] | ||
| + | * [https://alliance.seas.upenn.edu/~qnf/wiki/index.php?title=File:DicingSelection.png | Dicing Blade Selection] | ||
Revision as of 21:07, 6 April 2022
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| Tool Name | ADT 7100 Dicing Saw |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Dave Jones |
| Lab Location | Bay 2 |
| Tool Manufacturer | Advanced Dicing Technologies (ADT) |
| Tool Model | 7100 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | none |
| SOP Link | SOP |
Description
Workhorse dicing saw with precision dicing and alignment system. This is an automated tool with a 2″, DC-brushless, 1.2 kW, Front-mounted, Air-bearing Spindle (60 krpm Max.), with closed-loop turntable, and is optimized for multi-angle dicing of thin, tight tolerance products up to 200 mm x 200 mm.
Applications
- Dicing of Si wafers
- Dicing of glass wafers
- Dicing of sapphire wafers
