Lesker PVD75 DC/RF Sputterer

**Lesker PVD75 DC/RF Sputterer**
Tool Name	Lesker PVD75 DC/RF Sputterer
Instrument Type	Deposition
Staff Manager	David Barth
Lab Location	Bay 2
Tool Manufacturer	Kurt J. Lesker
Tool Model	PVD75
NEMO Designation	{{{NEMO_Designation}}}
Lab Phone	XXXXX
SOP Link	SOP

Description

The Kurt J. Lesker PVD75 Sputter system is configured with 4 sputter guns in the following configuration:

Target 1: RF power, insulating/conductive target
Target 2: DC power, magnetic/non-magnetic conductive target
Target 3: DC power, non-magnetic conductive target
Target 4: DC power, magnetic/non-magnetic conductive target

The system is cryo-pumped process chamber with an automated interface, wafer platen rotation and heating up to 550°C, accepting sample sized from pieces to 150 mm diameter wafers.

Deposition Sources

ITO
Cr
Ni
Fe
FeGa
NiFe
Ti
Ni
Cu
Al
SiO₂
TiO₂
Al₂O₃
Ge
Pt
Ag (Warning! Ag target must be cooled down for more than 15 min after depositing Ag film.)
Pd
Si
Mo
Various others - please consult with staff