SUSS MicroTec AS8 AltaSpray
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Tool Name | SUSS MicroTec AS8 AltaSpray |
---|---|
Instrument Type | Lithography |
Staff Manager | David Jones |
Lab Location | Bay 2 |
Tool Manufacturer | SUSS MicroTec |
Tool Model | AS8 AltaSpray |
NEMO Designation | {{{NEMO_Designation}}} |
Lab Phone | XXXXX |
SOP Link | SOP |
Description
SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm.
Applications
- Automated resist spray coater for high topographies