Lesker PVD75 DC/RF Sputterer

Lesker PVD75 DC/RF Sputterer

Tool Name	Lesker PVD75 DC/RF Sputterer
Instrument Type	Deposition
Staff Manager	David Barth
Lab Location	Bay 2
Tool Manufacturer	Kurt J. Lesker
Tool Model	PVD75
NEMO Designation	{{{NEMO_Designation}}}
Lab Phone	XXXXX
SOP Link	SOP

Description

The Kurt J. Lesker PVD75 Sputter system is configured with 4 sputter guns in the following configuration:

Target 1: RF power, insulating/conductive target
Target 2: DC power, magnetic/non-magnetic conductive target
Target 3: DC power, non-magnetic conductive target
Target 4: DC power, magnetic/non-magnetic conductive target

The system is cryo-pumped process chamber with an automated interface, wafer platen rotation and heating up to 550°C, accepting sample sized from pieces to 150 mm diameter wafers.

Deposition Sources

• ITO
• Cr
• Ni
• Fe
• FeGa
• NiFe
• Ti
• Ni
• Cu
• Al
• SiO₂
• TiO₂
• Al₂O₃
• Ge
• Pt
• Ag (Warning! Ag target must be cooled down for more than 15 min after depositing Ag film.)
• Pd
• Si
• Mo
• Various others - please consult with staff

Resources

Target Request Form

SOPs & Troubleshooting

• SOP

• PVD-03 Open Load SOP

Process Data

• PVD-03 Recipes
• Sputter Yield Chart

Note: The sputter yield chart can be useful for estimating approximately what rate to expect from materials, but the rate given is highly dependent on tool configuration and is not directly relevant