SUSS MicroTec AS8 AltaSpray
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| Tool Name | SUSS MicroTec AS8 AltaSpray |
|---|---|
| Instrument Type | Lithography |
| Staff Manager | David Jones |
| Lab Location | Bay 2 |
| Tool Manufacturer | SUSS MicroTec |
| Tool Model | AS8 AltaSpray |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
SUSS MicroTec’s proprietary AltaSpray coating technology is a unique resist deposition method that is capable of producing highly uniform resist films on different 3-D microstructures. The AltaSpray technology is capable of coating 90° corners, KOH etched cavities, Through Silicon Vias (TSVs) or lenses with topographies ranging from a few micron to 600µm or more. The ability to produce conformal resist coatings on severe topography makes them the ideal choice for R&D, MEMS, 3D-Integration and Wafer Level Packaging applications like 3D image sensor packaging. Wafer sizes from pieces to 200mm.
Applications
- Automated resist spray coater for high topographies
Resources
Process characterization and tool data
SOPs & Troubleshooting
- QNF SOP
- [https://upenn.box.com/s/gn8plnqgwwdn948zo0pywwnm0i1s93y4 AS8 Spray Coater Reboot Procedure