Lesker PVD75 DC/RF Sputterer

Lesker PVD75 DC/RF Sputterer

Tool Name	Lesker PVD75 DC/RF Sputterer
Instrument Type	Deposition
Staff Manager	David Barth
Lab Location	Bay 2
Tool Manufacturer	Kurt J. Lesker
Tool Model	PVD75
NEMO Designation	{{{NEMO_Designation}}}
Lab Phone	XXXXX
SOP Link	SOP

Description

The Kurt J. Lesker PVD75 Sputter system is configured with 4 sputter guns in the following configuration:

Target 1: RF power, insulating/conductive target
Target 2: DC power, magnetic/non-magnetic conductive target
Target 3: DC power, non-magnetic conductive target
Target 4: DC power, magnetic/non-magnetic conductive target

The system is cryo-pumped process chamber with an automated interface, wafer platen rotation and heating up to 550°C, accepting sample sized from pieces to 150 mm diameter wafers.

When choosing between PVD-03 and PVD-05, consider the following:

• PVD-03 is a load-locked system so base pressure will be better (~5e-8 torr vs. ~5e-6 torr) and pumpdown times will be much faster compared with PVD-05, which is an open load system.
• PVD-03 can handle one 6" wafer or one 4" wafer (or several smaller pieces) per run. PVD-05 has a large platen and can accept about four 4" wafers with good uniformity.
• PVD-03 is in a sputter up configuration, which means the guns point up and the sample must be attached upside down. This is usually considered cleaner, but requires greater consideration for sample mounting. PVD-05 is in sputter down configuration, so samples can just be placed on the platen.
• Magnetic materials can only be sputtered from PVD-03. PVD-05 does not have the necessary high mag sources

Deposition Sources

• ITO
• Cr
• Ni
• Fe
• FeGa
• NiFe
• Ti
• Ni
• Cu
• Al
• SiO₂
• TiO₂
• Al₂O₃
• Ge
• Pt
• Ag (Warning! Ag target must be cooled down for more than 15 min after depositing Ag film.)
• Pd
• Si
• Mo
• Various others - please consult with staff

Resources

Target Request Form

SOPs & Troubleshooting

• SOP

• PVD-03 Open Load SOP

Process Data

• PVD-03 Recipes
• Sputter Yield Chart

Note: The sputter yield chart can be useful for estimating approximately what rate to expect from materials, but the rate given is highly dependent on tool configuration and is not directly relevant