Lesker PVD75 DC/RF Sputterer

Lesker PVD75 DC/RF Sputterer

Tool Name	Lesker PVD75 DC/RF Sputterer
Instrument Type	Deposition
Staff Manager	David Barth
Lab Location	Bay 2
Tool Manufacturer	Kurt J. Lesker
Tool Model	PVD75
NEMO Designation	{{{NEMO_Designation}}}
Lab Phone	XXXXX
SOP Link	SOP

Description

The Kurt J. Lesker PVD75 Sputter system is configured with 4 sputter guns in the following configuration:

Target 1: RF power, insulating/conductive target
Target 2: DC power, magnetic/non-magnetic conductive target
Target 3: DC power, non-magnetic conductive target
Target 4: DC power, magnetic/non-magnetic conductive target

The system is cryo-pumped process chamber with an automated interface, wafer platen rotation and heating up to 550°C, accepting sample sized from pieces to 150 mm diameter wafers.

Deposition Sources

• ITO
• Cr
• Ni
• Fe
• FeGa
• NiFe
• Ti
• Ni
• Cu
• Al
• SiO₂
• TiO₂
• Al₂O₃
• Ge
• Pt
• Ag (Warning! Ag target must be cooled down for more than 15 min after depositing Ag film.)
• Pd
• Si
• Mo
• Various others - please consult with staff

Resources

SOPs & Troubleshooting

• SOP
• Target Request Form