Difference between revisions of "Heidelberg DWL 66+ Laser Writer"
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m (Changed protection level for "Heidelberg DWL 66+ Laser Writer" ([Edit=Allow only autoconfirmed users] (indefinite) [Move=Allow only autoconfirmed users] (indefinite))) |
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* Patterning of photomasks | * Patterning of photomasks | ||
* Direct laser writing of patterns | * Direct laser writing of patterns | ||
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| + | == Processes == | ||
| + | The following exposure parameters may be used to direct write into S1800 resist (soft baked at 115C for 1 minute) with the 10mm write head. For the optimum focus, please refer to the "AZ1500.txt" or "IP3500.txt" files for the optimum value to use. | ||
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Revision as of 15:55, 23 December 2022
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| Tool Name | Heidelberg DWL 66+ Laser Writer |
|---|---|
| Instrument Type | Lithography |
| Staff Manager | David Jones |
| Lab Location | Bay 2 |
| Tool Manufacturer | Heidelberg |
| Tool Model | DWL 66+ |
| NEMO Designation | {{{NEMO_Designation}}} |
| Nearest Phone | 8-9799 |
| SOP Link | SOP |
Description
The fully automated DWL 66+ laser writing system is located inside an environment chamber for stable environment of the system with controlled laminar airflow and temperature stability. The chamber is situated on a granite base with air cushions for vibration isolation. The optical system includes highly reflective mirrors and acousto-optic modulators for real-time beam correction.
Lens & Resolution
- 2 mm lens (optical autofocus): 600 nm
- 10 mm lens (pneumatic autofocus): 2 µm
- 40 mm lens (pneumatic autofocus): 10 µm
Applications
- Patterning of photomasks
- Direct laser writing of patterns
Processes
The following exposure parameters may be used to direct write into S1800 resist (soft baked at 115C for 1 minute) with the 10mm write head. For the optimum focus, please refer to the "AZ1500.txt" or "IP3500.txt" files for the optimum value to use.