Difference between revisions of "IPG IX280-DXF Green Micromachining Laser"
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* Hole Diameters down to 15 μm | * Hole Diameters down to 15 μm | ||
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== Resources == | == Resources == | ||
Revision as of 12:39, 6 April 2022
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| Tool Name | IPG IX280-DXF Green Micromachining Laser |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Eric Johnston |
| Lab Location | Bay 2 |
| Tool Manufacturer | IPG |
| Tool Model | IX280 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | 3-9639 |
| SOP Link | SOP |
Description
The IX280-DXF is a highly flexible laser micro-machining system for multipurpose, R&D and production applications. The system combines a Class 1 workstation integrated with a fiber laser and all necessary software.
Specifications
- Lasers at 532 or 1064 nm
- Pulse Energy up to 15 Joules (1064 nm)
- X-Y Positional Accuracy: <3 μm
- Z-theta Accuracy: <10 μm, ±0.02°
- Galvanometer Scanner or Fixed Optics
- Thermal Cutting Head
- Step and Scan Stage/ Galvo Integration
- Vision System Resolution 0.12 μm/ pixel
- DXF and CSV File Interface
Applications
Cutting Applications
- Ceramics, Metals, Polymers and Semiconductor Materials
- Patterning of ITO and other Thin-films
Drilling Applications
- Hole Diameters down to 15 μm
