Difference between revisions of "Denton Explorer14 Magnetron Sputterer"
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The tool is an open load system in sputter-down configuration with two DC guns and one RF gun and the ability to co-sputter one DC and one RF source. The tool is equipped with a cryo-pump, with automated interface and film thickness control, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling. | The tool is an open load system in sputter-down configuration with two DC guns and one RF gun and the ability to co-sputter one DC and one RF source. The tool is equipped with a cryo-pump, with automated interface and film thickness control, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling. | ||
− | Maximum DC Power is 600 W | + | Maximum DC Power is 600 W. |
− | Maximum RF Power is 200 W | + | Maximum RF Power is 200 W. |
Revision as of 10:16, 29 March 2022
Tool Name | Denton Explorer14 Magnetron Sputterer |
---|---|
Instrument Type | Deposition |
Staff Manager | Sam Azadi |
Lab Location | Bay 2 |
Tool Manufacturer | Denton |
Tool Model | Explorer14 |
NEMO Designation | {{{NEMO_Designation}}} |
Lab Phone | XXXXX |
SOP Link | SOP |
Description
The Denton Explorer-14 is a magnetron sputter deposition tool for depositing metallic and dielectric films. Sputter deposition is achieved by bombarding a source material with energetic ions, typically Ar+. Atoms at the surface of the target are knocked loose, and transported to the surface of the substrate, where deposition occurs.
The tool is an open load system in sputter-down configuration with two DC guns and one RF gun and the ability to co-sputter one DC and one RF source. The tool is equipped with a cryo-pump, with automated interface and film thickness control, accepting substrate sizes from pieces through wafers with 150 mm diameters. The tool has platen rotation and cooling.
Maximum DC Power is 600 W. Maximum RF Power is 200 W.
Deposition Sources
- ITO
- Cr
- Ti
- Ni
- Cu
- Al
- SiO2
- Ge
- Pt
- Au
- Ag
- Pd
- Si
- Al2O3
- Mo
- Te
- V