Difference between revisions of "RTA-02"

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(Created page with "Category:Thermal Processing {{EquipmentInfo | name = AET Thermal RX | Tool_Name = Rapid Thermal Annealer - 01 | image = 300px | imagecaption = | Inst...")
 
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== Description ==
 
== Description ==
  
The Rapid Thermal Annealer-01 anneals the sample up to 1200° C. The processes can be run under atmospheric pressure in Oxygen, Nitrogen, Forming Gas, and Argon environments. The tool can hold 4’’ wafers or smaller chips. Only MOS-compatible materials are allowed. Compound semiconductors and metals are not allowed.
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The Rapid Thermal Annealer-02 anneals the sample up to 1200° C. The processes can be run under atmospheric pressure in Nitrogen, Forming Gas, and Argon environments. The tool can hold 4’’ wafers or smaller chips. Only MOS-compatible materials are allowed. Compound semiconductors and metals are not allowed.
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== Resources ==
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===== SOP =====
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<pdf height="800"> File:RTA01_SOP_20240909.pdf</pdf>

Revision as of 13:56, 31 January 2025


AET Thermal RX
RTA01.jpg
Tool Name Rapid Thermal Annealer - 01
Instrument Type Thermal Processing
Staff Manager Lucas Barreto
Lab Location Bay 1
Tool Manufacturer AET
Tool Model Thermal RX
NEMO Designation RTA-01
Lab Phone 215-898-9736
SOP Link {{{SOP Link}}}

Description

The Rapid Thermal Annealer-02 anneals the sample up to 1200° C. The processes can be run under atmospheric pressure in Nitrogen, Forming Gas, and Argon environments. The tool can hold 4’’ wafers or smaller chips. Only MOS-compatible materials are allowed. Compound semiconductors and metals are not allowed.

Resources

SOP