Difference between revisions of "Lesker PVD75 DC/RF Sputterer"
Jump to navigation
Jump to search
(Created page with "Category:Deposition {{EquipmentInfo | name = Lesker PVD75 DC/RF Sputterer | Tool_Name = Lesker PVD75 DC/RF Sputterer | image = 300px | imagecaption...") |
|||
| Line 27: | Line 27: | ||
| − | ===== | + | ===== Deposition Sources ===== |
* ITO | * ITO | ||
* Cr | * Cr | ||
Revision as of 10:12, 29 March 2022
 |
|
| Tool Name | Lesker PVD75 DC/RF Sputterer |
|---|---|
| Instrument Type | Deposition |
| Staff Manager | David Jones |
| Lab Location | Bay 2 |
| Tool Manufacturer | Kurt J. Lesker |
| Tool Model | PVD75 |
| NEMO Designation | {{{NEMO_Designation}}} |
| Lab Phone | XXXXX |
| SOP Link | SOP |
Description
The Kurt J. Lesker PVD75 Sputter system is configured with 4 sputter guns in the following configuration:
Target 1: RF power, insulating/conductive target Target 2: DC power, magnetic/non-magnetic conductive target Target 3: DC power, non-magnetic conductive target Target 4: DC power, magnetic/non-magnetic conductive target
The system is cryo-pumped process chamber with automated interface and control of film thickness, wafer platen rotation and heating up to 550°C, accepting sample sized from pieces to 150 mm diameter wafers.
Deposition Sources
- ITO
- Cr
- Fe
- Ti
- Ni
- Cu
- Al
- SiO2
- Ge
- Pt
- Ag (Warning! Ag target must be cooled down for more than 15 min after depositing Ag film.)
- Pd
- Si
- Al2O3
- Mo
- Te
- V