Difference between revisions of "Heidelberg DWL 66+ Laser Writer"
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− | The following exposure parameters may be used to direct write into S1800 resist (soft baked at 115C for 1 minute) | + | The following exposure parameters may be used to direct write into S1800 resist (soft baked at 115C for 1 minute) on silicon. For the optimum focus, please refer to the "AZ1500.txt" or "IP3500.txt" files for the optimum value to use. |
− | {| class="wikitable | + | {| class="wikitable" |
|- | |- | ||
− | ! Resist | + | ! Resist |
− | ! Laser | + | ! Spin Speed (RPM) |
+ | ! Write Head | ||
+ | ! Filter(s) | ||
+ | ! Laser Power (mW) | ||
! Intensity | ! Intensity | ||
− | ! | + | ! # passes |
− | + | ! Focus mode | |
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|- | |- | ||
− | | | + | | S1805 |
− | | | + | | 3000 |
− | | | + | | 10mm |
− | | | + | | 50% |
+ | | 95 | ||
+ | | 60% | ||
+ | | 1 | ||
+ | | pneumatic | ||
|- | |- | ||
− | | | + | | S1805 |
− | | | + | | 3000 |
+ | | 2mm | ||
+ | | 1% | ||
+ | | 95 | ||
| 100% | | 100% | ||
− | | | + | | 1 |
+ | | pneumatic | ||
|- | |- | ||
− | | | + | | S1818 |
− | | | + | | 3000 |
− | | | + | | 10mm |
| None | | None | ||
+ | | 95 | ||
+ | | 90% | ||
+ | | 1 | ||
+ | | pneumatic | ||
|- | |- | ||
− | | | + | | S1818 |
− | + | | 3000 | |
− | + | | 2mm | |
− | + | | 12.5% | |
− | + | | 60 | |
− | + | | 40% | |
− | + | | 1 | |
− | + | | pneumatic | |
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Revision as of 15:41, 12 May 2023
Tool Name | Heidelberg DWL 66+ Laser Writer |
---|---|
Instrument Type | Lithography |
Staff Manager | David Jones |
Lab Location | Bay 2 |
Tool Manufacturer | Heidelberg |
Tool Model | DWL 66+ |
NEMO Designation | {{{NEMO_Designation}}} |
Lab Phone | 8-9799 |
SOP Link | SOP |
Description
The fully automated DWL 66+ laser writing system is located inside an environment chamber for stable environment of the system with controlled laminar airflow and temperature stability. The chamber is situated on a granite base with air cushions for vibration isolation. The optical system includes highly reflective mirrors and acousto-optic modulators for real-time beam correction.
Lens & Resolution
- 2 mm lens (optical autofocus): 600 nm
- 10 mm lens (pneumatic autofocus): 2 µm
- 40 mm lens (pneumatic autofocus): 10 µm
Applications
- Patterning of photomasks
- Direct laser writing of patterns
Processes
The following exposure parameters may be used to expose photomasks.
Resist | Write Head | Filter(s) | Laser Power (mW) | Intensity | Focus | # of passes | Focus mode |
---|---|---|---|---|---|---|---|
AZ1500 | 10mm | 50% | 65 | 90% | -30 | 1 | Pneumatic |
IP3500 | 10mm | None | 95 | 90% | -30 | 1 | Pneumatic |
IP3500 | 2mm | 50% & 12.5% | 60 | 60% | -5 | 1 | Pneumatic |
The following exposure parameters may be used to direct write into S1800 resist (soft baked at 115C for 1 minute) on silicon. For the optimum focus, please refer to the "AZ1500.txt" or "IP3500.txt" files for the optimum value to use.
Resist | Spin Speed (RPM) | Write Head | Filter(s) | Laser Power (mW) | Intensity | # passes | Focus mode |
---|---|---|---|---|---|---|---|
S1805 | 3000 | 10mm | 50% | 95 | 60% | 1 | pneumatic |
S1805 | 3000 | 2mm | 1% | 95 | 100% | 1 | pneumatic |
S1818 | 3000 | 10mm | None | 95 | 90% | 1 | pneumatic |
S1818 | 3000 | 2mm | 12.5% | 60 | 40% | 1 | pneumatic |