Difference between revisions of "Raith EBPG5200+ E-Beam Lithography System"
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===== Useful Information ===== | ===== Useful Information ===== | ||
− | * [[ | + | * [[Media:EBPG5200+_SOP.pdf | SOP]] |
* [https://upenn.box.com/s/atymr3okn3xf20rb1kvk7ny79plojobm Graph of Spotsize vs. Current (Internal Use Only)] | * [https://upenn.box.com/s/atymr3okn3xf20rb1kvk7ny79plojobm Graph of Spotsize vs. Current (Internal Use Only)] | ||
* [https://upenn.box.com/s/gzj28stdehm1kfmwjpcnio7vimr4m1w9 Alignment Mark Guidelines] | * [https://upenn.box.com/s/gzj28stdehm1kfmwjpcnio7vimr4m1w9 Alignment Mark Guidelines] |
Revision as of 10:13, 6 November 2024
Tool Name | Raith EBPG5200+ EBL |
---|---|
Instrument Type | Lithography |
Staff Manager | David Barth |
Lab Location | Bay 4 |
Tool Manufacturer | Raith |
Tool Model | EBPG5200+ |
NEMO Designation | EBL-03 |
Lab Phone | 8-9799 |
SOP Link | SOP |
Description
The Raith EBPG5200+ is an electron beam lithography tool capable of high resolution patterning at 100 kV. It has a 125 MHz pattern generator, a maximum current of 350 nA, and a 1 mm mainfield size. It has an automatic aperture changer, automatic and dynamic focus and stigmation, and automatic alignment. The EBPG can achieve linewidths <8nm with stitching and overlay accuracy better than 10nm.
Applications
- Large scale, high speed patterning of positive and negative e-beam resists with features from <10 nm to micron/mm scale
Allowed Materials
- Standard semiconductor materials
- Low vapor pressure metals
- Resists
Resources
SOP